发明申请
- 专利标题: HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- 专利标题(中): 混合热辐射基板及其制造方法
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申请号: US12900226申请日: 2010-10-07
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公开(公告)号: US20110303440A1公开(公告)日: 2011-12-15
- 发明人: Chang Hyun LIM , Jung Eun KANG , Heung Soo PARK , Seog Moon CHOI , Kwang Soo KIM , Joon Seok CHAE , Sung Keun PARK
- 申请人: Chang Hyun LIM , Jung Eun KANG , Heung Soo PARK , Seog Moon CHOI , Kwang Soo KIM , Joon Seok CHAE , Sung Keun PARK
- 申请人地址: KR Gyunggi-do
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Gyunggi-do
- 优先权: KR10-2010-0056616 20100615
- 主分类号: H05K1/03
- IPC分类号: H05K1/03 ; H05K3/44 ; C23C28/00
摘要:
Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.