Invention Application
- Patent Title: Method of manufacturing cooling fin and package substrate with cooling fin
- Patent Title (中): 制冷散热片和散热片封装基板的制作方法
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Application No.: US13137669Application Date: 2011-09-01
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Publication No.: US20110308069A1Publication Date: 2011-12-22
- Inventor: Eung Suek LEE , Je Gwang YOO , Chang Sup RYU , Jun Oh HWANG , Jun Heyoung PARK , Jee Soo MOK
- Applicant: Eung Suek LEE , Je Gwang YOO , Chang Sup RYU , Jun Oh HWANG , Jun Heyoung PARK , Jee Soo MOK
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2008-0051003 20080530
- Main IPC: H05K13/00
- IPC: H05K13/00 ; C04B35/64
Abstract:
A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object.
Public/Granted literature
- US08377748B2 Method of manufacturing cooling fin and package substrate with cooling fin Public/Granted day:2013-02-19
Information query
