公开(公告)号：US08865393B2

公开(公告)日：2014-10-21

申请号：US13213939

申请日：2011-08-19

申请人： Dae Jo Hong ,  Chang Sup Ryu ,  Cheol Ho Choi

发明人： Dae Jo Hong ,  Chang Sup Ryu ,  Cheol Ho Choi

IPC分类号： G03F7/20 ,  H05K3/30 ,  H01L21/48 ,  H01L23/498 ,  H01L21/56 ,  H05K3/28 ,  H05K3/34 ,  H01L23/00

CPC分类号： H05K3/305 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H05K3/28 ,  H05K3/3436 ,  H05K3/3452 ,  Y02P70/613 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2924/014

摘要： Disclosed herein are a printed circuit board and a method of manufacturing the same, including: forming a protective layer on which a cover film is stacked on a base substrate; exposing the protective layer on which the cover film is stacked to photosensitize the protective layer and photodegrade the cover film; and developing the photodegraded cover film and the photosensitized protective layer to form an opening exposing a pad unit of a circuit layer which is an outermost layer of the base substrate on the protective layer, whereby the productivity of the printed circuit board can be improved without performing a process of separating a cover film.

摘要翻译： 这里公开了一种印刷电路板及其制造方法，包括：在基底基板上形成覆盖膜层叠的保护层; 使覆盖膜层叠的保护层曝光，对保护层进行光敏化，使遮盖膜光降解; 以及显影光降解的覆盖膜和光敏保护层，以形成在保护层上露出作为基底基板的最外层的电路层的焊盘单元的开口，由此可以提高印刷电路板的生产率，而不执行 分离覆盖膜的过程。

公开(公告)号：US20130175238A1

公开(公告)日：2013-07-11

申请号：US13474335

申请日：2012-05-17

申请人： Dae Jo HONG ,  Chang Bo LEE ,  Cheol Ho CHOI ,  Chang Sup RYU ,  Sung Pyo HONG ,  Jong Hoon JEON ,  Akira HOSOMI ,  Hiroshi TAKAMIYA

发明人： Dae Jo HONG ,  Chang Bo LEE ,  Cheol Ho CHOI ,  Chang Sup RYU ,  Sung Pyo HONG ,  Jong Hoon JEON ,  Akira HOSOMI ,  Hiroshi TAKAMIYA

IPC分类号： C09K13/06 ,  H05K3/00

CPC分类号： C09K13/06 ,  H05K3/067 ,  H05K3/383

摘要： This invention relates to an etching solution including hydrogen peroxide, sulfuric acid, chlorine ions, benzotriazole and pyrazole, and to a method of manufacturing a printed wiring substrate wherein the surface of the metal wiring of the printed wiring substrate is treated with an alkali solution, roughened using the etching solution and then subjected to anti-rust treatment, thus forming porous surface irregularities and micro anchors even with a small etching amount of the metal (Cu) to thereby obtain a high force of adhesion between the metal and an insulating material.

摘要翻译： 本发明涉及包括过氧化氢，硫酸，氯离子，苯并三唑和吡唑的蚀刻溶液，以及印刷线路基板的金属布线的表面用碱溶液处理的印刷布线基板的制造方法， 使用蚀刻溶液进行粗糙化，然后进行防锈处理，从而即使用小的蚀刻量的金属（Cu）也形成多孔表面凹凸和微锚，从而获得金属和绝缘材料之间的高粘合力。

公开(公告)号：US08432706B2

公开(公告)日：2013-04-30

申请号：US12654541

申请日：2009-12-22

申请人： Han Kim ,  Chang-Sup Ryu

发明人： Han Kim ,  Chang-Sup Ryu

IPC分类号： H05K1/11

CPC分类号： H05K1/0237 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/3025 ,  H01Q1/526 ,  H05K1/0224 ,  H05K1/0236 ,  H05K1/0298 ,  H05K1/144 ,  H05K1/183 ,  H05K9/0009 ,  H05K9/0052 ,  H05K2201/09681 ,  H05K2201/10371

摘要： A printed circuit board and an electronic product are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a first board, which has an electronic component mounted thereon, and a second board, which is positioned on an upper side of the first board and covers at least a portion of an upper surface of the first board and in which an EBG structure is inserted into the second board such that a noise radiating upwards from the first board is shielded. Thus, the printed circuit board can readily absorb various frequencies, be easily applied without any antenna effect and be cost-effective in manufacturing.

摘要翻译： 公开了印刷电路板和电子产品。 根据本发明的实施例，印刷电路板包括：第一板，其上安装有电子部件;第二板，其位于第一板的上侧，并且覆盖至少一部分 第一板的上表面，并且其中EBG结构插入到第二板中，使得从第一板向上辐射的噪声被屏蔽。 因此，印刷电路板可以容易地吸收各种频率，容易应用而没有任何天线效应，并且在制造中是成本有效的。

公开(公告)号：US20130026626A1

公开(公告)日：2013-01-31

申请号：US13487926

申请日：2012-06-04

申请人： Cheol Ho CHOI ,  Chang Bo LEE ,  Chang Sup RYU

发明人： Cheol Ho CHOI ,  Chang Bo LEE ,  Chang Sup RYU

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H05K3/4007 ,  H01L21/4853 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/1132 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/381 ,  H05K2203/041 ,  H05K2203/043 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： Disclosed herein are a method for forming bumps and a substrate including the bumps. The method includes: coating a solder resist on a substrate and electrodes formed on the substrate: performing laser etching treatment on the solder resist to form openings for forming bumps; printing a composition for forming bumps in the openings for forming bumps; and performing a reflowing process.The present invention can decrease the number of processes and realize a fine bump pitch of 90 μm or less at the time of forming bumps. Further, the present invention can also decrease the number of times that alignment is performed, due to the decrease in the number of processes.

摘要翻译： 本文公开了一种用于形成凸块的方法和包括该凸块的基板。 该方法包括：在基板上形成阻焊剂和在基板上形成的电极：对阻焊剂进行激光蚀刻处理，形成用于形成凸块的开口; 在用于形成凸块的开口中印刷用于形成凸块的组合物; 并进行回流处理。 本发明可以减少处理次数，并且在形成凸块时实现90μm以下的微小凸点间距。 此外，由于处理次数的减少，本发明还可以减少对准的次数。

公开(公告)号：US08151446B2

公开(公告)日：2012-04-10

申请号：US12076223

申请日：2008-03-14

申请人： Jee-Soo Mok ,  Je-Gwang Yoo ,  Yoong Oh ,  Jong-Seok Bae ,  Chang-Sup Ryu

发明人： Jee-Soo Mok ,  Je-Gwang Yoo ,  Yoong Oh ,  Jong-Seok Bae ,  Chang-Sup Ryu

IPC分类号： B23P19/04

CPC分类号： H05K3/4647 ,  B29C43/28 ,  B29C43/46 ,  H05K3/4069 ,  H05K2203/0143 ,  H05K2203/1189 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/53126 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187

摘要： An apparatus for manufacturing a printed circuit board that uses conductive bumps to interconnect layers includes: a conveyor unit, which is configured to transport a board that has the conductive bumps formed on one side; an upper roller and a lower roller, which press the board and an insulator together; an elastic coating layer, formed on a surface of the upper roller; and a cleaning device, which removes impurities from a surface of the elastic coating layer. The apparatus does not require a separate device for performing a cushioning function and a detaching function between the bumps and the rollers, and the rollers can be kept clean using a cleaning device.

摘要翻译： 用于制造使用导电凸块以互连层的印刷电路板的装置包括：输送单元，其被配置为输送在一侧形成有导电凸块的板; 上辊和下辊，将板和绝缘体压在一起; 形成在上辊的表面上的弹性涂层; 以及从弹性涂层的表面除去杂质的清洗装置。 该装置不需要用于执行缓冲功能和凸块和辊之间的分离功能的单独装置，并且可以使用清洁装置将辊保持清洁。

公开(公告)号：US20120043126A1

公开(公告)日：2012-02-23

申请号：US13213939

申请日：2011-08-19

申请人： Dae Jo HONG ,  Chang Sup RYU ,  Cheol Ho CHOI

发明人： Dae Jo HONG ,  Chang Sup RYU ,  Cheol Ho CHOI

IPC分类号： H05K1/02 ,  H05K1/00 ,  H05K3/00

CPC分类号： H05K3/305 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H05K3/28 ,  H05K3/3436 ,  H05K3/3452 ,  Y02P70/613 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2924/014

摘要： Disclosed herein are a printed circuit board and a method of manufacturing the same, including: forming a protective layer on which a cover film is stacked on a base substrate; exposing the protective layer on which the cover film is stacked to photosensitize the protective layer and photodegrade the cover film; and developing the photodegraded cover film and the photosensitized protective layer to form an opening exposing a pad unit of a circuit layer which is an outermost layer of the base substrate on the protective layer, whereby the productivity of the printed circuit board can be improved without performing a process of separating a cover film.

摘要翻译： 这里公开了一种印刷电路板及其制造方法，包括：在基底基板上形成覆盖膜层叠的保护层; 使覆盖膜层叠的保护层曝光，对保护层进行光敏化，使遮盖膜光降解; 以及显影光降解的覆盖膜和光敏保护层，以形成在保护层上露出作为基底基板的最外层的电路层的焊盘单元的开口，由此可以提高印刷电路板的生产率，而不执行 分离覆盖膜的过程。

公开(公告)号：US20110303636A1

公开(公告)日：2011-12-15

申请号：US13137505

申请日：2011-08-22

申请人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

发明人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

IPC分类号： H05K3/22

CPC分类号： H05K1/113 ,  H01L23/13 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/20 ,  H05K3/4644 ,  H05K2201/0376 ,  H05K2201/09472 ,  H01L2224/0401

摘要： A method of manufacturing a mounting substrate, the method including: providing an insulation layer, the insulation layer having a circuit pattern formed in one side thereof; forming at least one bonding pad in the other side of the insulation layer, the bonding pad electrically connected with the circuit pattern; and etching the bonding pad such that a surface of the bonding pad is recessed from a surface of the insulation layer by a predetermined depth.

摘要翻译： 一种安装基板的制造方法，所述方法包括：提供绝缘层，所述绝缘层具有形成在其一侧的电路图案; 在所述绝缘层的另一侧形成至少一个焊盘，所述焊盘与所述电路图案电连接; 以及蚀刻所述焊盘，使得所述焊盘的表面从所述绝缘层的表面凹陷预定深度。

公开(公告)号：US08003439B2

公开(公告)日：2011-08-23

申请号：US12385316

申请日：2009-04-03

申请人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

发明人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacturing a board on chip package including laminating a dry film on a carrier film, one side of which is laminated by a thin metal film; patterning the dry film in accordance with a circuit wire through light exposure and developing process, and forming a solder ball pad and a circuit wire; removing the dry film; laminating an upper photo solder resist excluding a portion where the solder ball pad is formed; etching the thin metal film formed on a portion where the upper photo solder resist is not laminated; mounting a semiconductor chip on the solder ball pad by a flip chip bonding; molding the semiconductor chip with a passivation material; removing the carrier film and the thin metal film; and laminating a lower photo solder resist under the solder ball pad. The board on chip package provides a high density circuit since a circuit pattern is formed using a seed layer.

摘要翻译： 一种制造片上封装的方法，包括在载体膜上层叠干膜，其一面由薄金属膜层压; 通过曝光和显影工艺根据电路线图案化干膜，并形成焊球焊盘和电路线; 去除干膜; 层压除了形成焊球垫的部分之外的上光阻焊剂; 蚀刻形成在上层光阻焊层未层叠的部分上的金属薄膜; 通过倒装芯片焊接将半导体芯片安装在焊球垫上; 用钝化材料成型半导体芯片; 去除载体膜和金属薄膜; 并在焊球下方层叠下光阻焊剂。 由于使用种子层形成电路图案，片上封装芯片提供了高密度电路。

公开(公告)号：US20110197409A1

公开(公告)日：2011-08-18

申请号：US13064847

申请日：2011-04-20

申请人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

发明人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

IPC分类号： H01G7/00

CPC分类号： H05K1/162 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09563 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method of fabricating a cavity capacitor embedded in a printed circuit board including two conductive layers to be used as a power layer and a ground layer, respectively, and a first dielectric layer, placed between the two conductive layers, the method including: removing an upper conductive layer and the first dielectric layer excluding a lower conductive layer of the two conductive layers to allow a cavity to be formed between the two conductive layers, the lower conductive layer being supposed to be used as any one of electrodes of the cavity capacitor; stacking a dielectric material on the cavity to allow a second dielectric layer having a lower stepped portion than the first dielectric layer to be formed in the cavity; and stacking a conductive material on an upper part of the second dielectric layer and side parts of the cavity to allow the upper conductive layer to be used as the other electrode of the cavity capacitor.

摘要翻译： 一种嵌入在印刷电路板中的空腔电容器的方法，包括分别用作功率层和接地层的两个导电层和放置在两个导电层之间的第一介电层，所述方法包括： 上导电层和除了两个导电层的下导电层之外的第一电介质层，以允许在两个导电层之间形成腔，下导电层假定用作空腔电容器的任一电极; 在所述空腔上堆叠电介质材料以允许在所述空腔中形成具有比所述第一电介质层更低的台阶部分的第二电介质层; 并且在第二电介质层的上部和空腔的侧部上堆叠导电材料，以允许上部导电层用作空腔电容器的另一个电极。

公开(公告)号：US20110061907A1

公开(公告)日：2011-03-17

申请号：US12654538

申请日：2009-12-22

申请人： Myung Sam Kang ,  Chang Sup Ryu

发明人： Myung Sam Kang ,  Chang Sup Ryu

IPC分类号： H05K1/09 ,  H05K1/11 ,  C25D5/02 ,  B32B38/00

CPC分类号： C25D5/022 ,  C25D7/12 ,  H05K3/0035 ,  H05K3/242 ,  H05K3/243 ,  H05K3/3473 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2203/054 ,  H05K2203/0577 ,  H05K2203/1581

摘要： A printed circuit board according to an aspect of the invention may include: a board portion having an electrode portion provided on a surface thereof; a solder resist layer provided on the surface of the board portion and having an opening therein to expose the electrode portion to the outside; and a bump layer having the same diameter as the opening and providing an electrical connection with an external chip component.

摘要翻译： 根据本发明的一个方面的印刷电路板可以包括：具有设置在其表面上的电极部分的板部分; 阻焊层，设置在基板部分的表面上，并且在其中具有开口以将电极部分暴露于外部; 以及具有与开口相同直径并且提供与外部芯片部件的电连接的凸块层。