公开(公告)号：US20110308069A1

公开(公告)日：2011-12-22

申请号：US13137669

申请日：2011-09-01

申请人： Eung Suek LEE ,  Je Gwang YOO ,  Chang Sup RYU ,  Jun Oh HWANG ,  Jun Heyoung PARK ,  Jee Soo MOK

发明人： Eung Suek LEE ,  Je Gwang YOO ,  Chang Sup RYU ,  Jun Oh HWANG ,  Jun Heyoung PARK ,  Jee Soo MOK

IPC分类号： H05K13/00 ,  C04B35/64

CPC分类号： H01L23/373 ,  B82Y30/00 ,  C04B35/80 ,  C04B2235/3217 ,  C04B2235/3418 ,  C04B2235/407 ,  C04B2235/408 ,  C04B2235/5288 ,  F28F3/02 ,  F28F21/02 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  Y10T29/49002 ,  Y10T29/4935 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object.

摘要翻译： 一种冷却翅片和封装基板的制造方法，其特征在于，包括：准备模具，所述模具具有支撑基体和树脂层，所述支撑基底和树脂层形成在所述支撑基部上，并且在其一侧包括凹槽，所述凹槽被构造成形成冷却翅片; 在所述模具的侧面上印刷含有碳成分的可燃性糊料，所述成型体具有形成冷却翅片的所述凹槽; 移除支撑底座以留下冷却物体; 并发射冷却对象。

公开(公告)号：US20100230146A1

公开(公告)日：2010-09-16

申请号：US12544959

申请日：2009-08-20

申请人： Eung Suek LEE ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jee Soo Mok

发明人： Eung Suek LEE ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jee Soo Mok

IPC分类号： H05K1/09 ,  C25D5/02

CPC分类号： H05K3/108 ,  B82Y10/00 ,  C23C18/38 ,  C25D5/022 ,  C25D5/10 ,  C25D9/08 ,  H05K3/249 ,  H05K2201/026 ,  H05K2201/0347 ,  H05K2203/135

摘要： Disclosed herein is a circuit layer including CNTs including an electroless copper plating layer formed on an insulating layer, and a CNT layer deposited on the electroless copper plating layer, thus the circuit layer has excellent electrical properties.

摘要翻译： 本发明公开了一种电路层，其包括在绝缘层上形成的化学镀铜层的CNT和沉积在化学镀铜层上的CNT层，因此电路层具有优异的电性能。

公开(公告)号：US20120088334A1

公开(公告)日：2012-04-12

申请号：US13007444

申请日：2011-01-14

申请人： Mi Sun HWANG ,  Keung Jin SOHN ,  Eung Suek LEE ,  Myung Sam KANG

发明人： Mi Sun HWANG ,  Keung Jin SOHN ,  Eung Suek LEE ,  Myung Sam KANG

IPC分类号： H01L21/60

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/81192 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15311 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4647 ,  H05K2203/0384 ,  H01L2924/00015 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a method for manufacturing a semiconductor package which uses a base member 120 in which a first metal layer 113, a barrier layer 115, and a second metal layer 117 are stacked on both surface thereof in sequence based on an adhesive member 111 to simultaneously manufacture two printed circuit boards through a single sheet process, thereby making it possible to improve manufacturing efficiency; electrically connects a semiconductor chip 300 to a printed circuit board through a solder bump 250, thereby making it possible to implement a high-density package substrate; and forms a metal post 140 instead of a through hole to required in an interlayer circuit connection, thereby making it possible to reduce costs required in the processing/plating of the through hole.

摘要翻译： 本发明公开了一种半导体封装件的制造方法，该半导体封装件使用基片120，其中第一金属层113，阻挡层115和第二金属层117依次以两个表面层叠在第一金属层113，阻挡层115和第二金属层117上， 同时通过单片工艺制造两个印刷电路板，从而可以提高制造效率; 通过焊料凸块250将半导体芯片300电连接到印刷电路板，从而可以实现高密度封装基板; 并且形成金属柱140而不是层间电路连接所需的通孔，从而可以降低通孔的加工/电镀所需的成本。

公开(公告)号：US20120103671A1

公开(公告)日：2012-05-03

申请号：US13007474

申请日：2011-01-14

申请人： Eung Suek LEE ,  Kwang Seop YOUM ,  Keung Jin SOHN ,  Mi Sun HWANG

发明人： Eung Suek LEE ,  Kwang Seop YOUM ,  Keung Jin SOHN ,  Mi Sun HWANG

IPC分类号： H05K1/18 ,  H05K1/11 ,  H05K3/00 ,  H05K1/00

CPC分类号： H05K3/4069 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K2203/1461 ,  Y10T29/49124

摘要： Disclosed herein are a printed circuit board and a method for manufacturing the same capable of implementing a slim and small semiconductor package by the printed circuit board configured to include a circuit layer and an insulating layer as a single layer and shortening a process time and reducing processing costs by forming a bump using a screen printing method. Further, disclosed herein is a method for manufacturing a printed circuit board capable of improving a warpage problem of the printed circuit board that occurs during a polishing process by adopting a coining process instead of a polishing process.

摘要翻译： 这里公开了一种印刷电路板及其制造方法，该印刷电路板及其制造方法能够通过印刷电路板实现薄型和小型半导体封装，该印刷电路板被配置为包括电路层和绝缘层作为单层并缩短处理时间并减少处理 通过使用丝网印刷法形成凹凸的成本。 此外，本文公开了一种制造印刷电路板的方法，其能够通过采用压印处理而不是抛光工艺来改善在抛光过程中发生的印刷电路板的翘曲问题。