Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Patent Title (中): 半导体器件及其形成方法
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Application No.: US13240575Application Date: 2011-09-22
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Publication No.: US20120007193A1Publication Date: 2012-01-12
- Inventor: Jin-Sung Lee , Woon-Kyung Lee
- Applicant: Jin-Sung Lee , Woon-Kyung Lee
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2008-0022993 20080312
- Main IPC: H01L27/088
- IPC: H01L27/088

Abstract:
A semiconductor device includes a plurality of transistors disposed on a semiconductor substrate, a device isolation layer disposed around the transistors, a guard ring disposed to surround the device isolation layer and the transistors, and a guard region disposed between adjacent transistors.
Public/Granted literature
- US08119460B2 Semiconductor device and method of forming the same Public/Granted day:2012-02-21
Information query
IPC分类: