- 专利标题: SYSTEM-IN-A-PACKAGE BASED FLASH MEMORY CARD
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申请号: US13235852申请日: 2011-09-19
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公开(公告)号: US20120009732A1公开(公告)日: 2012-01-12
- 发明人: Hem Takiar , Robert C. Miller , Warren Middlekauff , Michael W. Patterson , Shrikar Bhagath
- 申请人: Hem Takiar , Robert C. Miller , Warren Middlekauff , Michael W. Patterson , Shrikar Bhagath
- 主分类号: H01L21/56
- IPC分类号: H01L21/56
摘要:
A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
公开/授权文献
- US08852999B2 System-in-a-package based flash memory card 公开/授权日:2014-10-07
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