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公开(公告)号：US08637978B2
公开(公告)日：2014-01-28
申请号：US13235781
申请日：2011-09-19
CPC分类号： G06K19/07745 , G06K19/07732 , G11C5/04 , H01L21/565 , H01L23/3107 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L2223/5442 , H01L2223/54433 , H01L2223/54473 , H01L2223/54486 , H01L2224/32145 , H01L2224/48225 , H01L2224/48227 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/181 , H05K3/0052 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
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公开(公告)号：US08852999B2
公开(公告)日：2014-10-07
申请号：US13235852
申请日：2011-09-19
IPC分类号： H01L21/00 , H01L33/00 , G06K19/077 , H01L25/16 , H01L21/56 , H01L25/065 , G11C5/04 , H01L23/31 , H01L31/0203 , H01L23/29 , H01L23/28 , H01L21/50 , H01L23/00 , H05K3/00 , H05K1/18
CPC分类号： G06K19/07745 , G06K19/07732 , G11C5/04 , H01L21/565 , H01L23/3107 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L2223/5442 , H01L2223/54433 , H01L2223/54473 , H01L2223/54486 , H01L2224/32145 , H01L2224/48225 , H01L2224/48227 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/181 , H05K3/0052 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
摘要翻译： 一种基于系统的基于包的闪存卡，其包括集成电路封装，其占据卡内的小的整体区域并且被切割以符合卡的盖的形状。 集成电路可以从面板切割成适合于并符合成品存储卡（例如SD卡）的盖的形状的形状。 集成电路封装可以是系统级封装，多芯片模块或其中在单个封装中形成完整电子系统的其它布置。
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公开(公告)号：US20120007226A1
公开(公告)日：2012-01-12
申请号：US13235781
申请日：2011-09-19
IPC分类号： H01L23/02
CPC分类号： G06K19/07745 , G06K19/07732 , G11C5/04 , H01L21/565 , H01L23/3107 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L2223/5442 , H01L2223/54433 , H01L2223/54473 , H01L2223/54486 , H01L2224/32145 , H01L2224/48225 , H01L2224/48227 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/181 , H05K3/0052 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
摘要翻译： 一种基于系统的基于包的闪存卡，其包括集成电路封装，其占据卡内的小的整体区域并且被切割以符合卡的盖的形状。 集成电路可以从面板切割成适合于并符合成品存储卡（例如SD卡）的盖的形状的形状。 集成电路封装可以是系统级封装，多芯片模块或其中在单个封装中形成完整电子系统的其它布置。
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公开(公告)号：US20120009732A1
公开(公告)日：2012-01-12
申请号：US13235852
申请日：2011-09-19
IPC分类号： H01L21/56
CPC分类号： G06K19/07745 , G06K19/07732 , G11C5/04 , H01L21/565 , H01L23/3107 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L2223/5442 , H01L2223/54433 , H01L2223/54473 , H01L2223/54486 , H01L2224/32145 , H01L2224/48225 , H01L2224/48227 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/181 , H05K3/0052 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
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公开(公告)号：US08022519B2
公开(公告)日：2011-09-20
申请号：US11133576
申请日：2005-05-19
IPC分类号： H01L23/02
CPC分类号： G06K19/07745 , G06K19/07732 , G11C5/04 , H01L21/565 , H01L23/3107 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L2223/5442 , H01L2223/54433 , H01L2223/54473 , H01L2223/54486 , H01L2224/32145 , H01L2224/48225 , H01L2224/48227 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/181 , H05K3/0052 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
摘要翻译： 一种基于系统的基于包的闪存卡，其包括集成电路封装，其占据卡内的小的整体区域并且被切割以符合卡的盖的形状。 集成电路可以从面板切割成适合于并符合成品存储卡（例如SD卡）的盖的形状的形状。 集成电路封装可以是系统级封装，多芯片模块或其中在单个封装中形成完整电子系统的其它布置。
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公开(公告)号：USD548740S1
公开(公告)日：2007-08-14
申请号：US29230382
申请日：2005-05-19
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公开(公告)号：US20060261454A1
公开(公告)日：2006-11-23
申请号：US11133576
申请日：2005-05-19
IPC分类号： H01L23/02
CPC分类号： G06K19/07745 , G06K19/07732 , G11C5/04 , H01L21/565 , H01L23/3107 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L2223/5442 , H01L2223/54433 , H01L2223/54473 , H01L2223/54486 , H01L2224/32145 , H01L2224/48225 , H01L2224/48227 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/181 , H05K3/0052 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
摘要翻译： 一种基于系统的基于包的闪存卡，其包括集成电路封装，其占据卡内的小的整体区域并且被切割以符合卡的盖的形状。 集成电路可以从面板切割成适合于并符合成品存储卡（例如SD卡）的盖的形状的形状。 集成电路封装可以是系统级封装，多芯片模块或其中在单个封装中形成完整电子系统的其它布置。
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公开(公告)号：US07193161B1
公开(公告)日：2007-03-20
申请号：US11356279
申请日：2006-02-15
申请人： Hem Takiar , Warren Middlekauff , Robert C. Miller
发明人： Hem Takiar , Warren Middlekauff , Robert C. Miller
IPC分类号： H01L23/28
CPC分类号： H01L23/49855 , H01L24/73 , H01L24/97 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01322 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , Y10T29/49171 , Y10T29/49172 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： A single-lid flash memory card and methods of manufacturing same are disclosed. The single-sided lid flash memory card may be formed from a semiconductor package having two or more tapered, stepped or otherwise shaped edges capable of securing a single-sided lid thereon. The taper, step or other shape may be fabricated by various methods, including during the molding step or during the singulation step. A semiconductor package having shaped edges may be enclosed within an external lid to form a finished flash memory card. The lid may be applied to a single side of the semiconductor package by various processes, including over-molding, or by pre-forming the lid with interior edges to match the exterior edges of the semiconductor package, and then sliding the lid over the package to form a tight fit therebetween. The shaped edge of the semiconductor package effectively holds the lid securely on the memory card without any adhesives and prevents the lid from dislodging from the semiconductor package.
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公开(公告)号：US20080030963A1
公开(公告)日：2008-02-07
申请号：US11462430
申请日：2006-08-04
IPC分类号： H05K1/14
CPC分类号： G06K19/077 , G06K19/07732 , G06K19/07743 , H01R12/88 , H05K5/026 , H05K5/0278
摘要： An enclosed re-programmable non-volatile memory card includes a cover that is hinged to the card to normally cover a set of external contacts to which the memory is connected but which can be rotated out of the way by hand to expose that set of contacts for connection with a mating receptacle of a host device. A second set of electrical contacts having a different pattern than the covered set may also be provided on the card. The covered set of contacts may be in accordance with the universal serial bus (USB) plug standards. A latching mechanism built into the hinged cover holds it firmly in a closed position but allows its manual release to expose the covered set of contacts. One exemplary release mechanism utilizes a resiliently held element that is moveable by hand against the resilience, and another employs a hand slideable latch.
摘要翻译： 封闭的可重新编程的非易失性存储卡包括铰链到卡的盖，以正常覆盖一组外部触点，存储器连接到该外部触点，但是可以用手旋转以露出该组触点 用于与主机设备的配合插座连接。 具有与覆盖组不同的图案的第二组电触点也可以设置在卡上。 覆盖的触点组可能符合通用串行总线（USB）插头标准。 内置在铰链盖中的锁定机构将其牢固地保持在关闭位置，但允许其手动释放以暴露所覆盖的一组触点。 一种示例性的释放机构利用可弹性保持的元件，该元件可用手抵靠弹性移动，另一种采用手动滑动闩锁。
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公开(公告)号：US07710736B2
公开(公告)日：2010-05-04
申请号：US11462430
申请日：2006-08-04
IPC分类号： H05K5/03
CPC分类号： G06K19/077 , G06K19/07732 , G06K19/07743 , H01R12/88 , H05K5/026 , H05K5/0278
摘要： An enclosed re-programmable non-volatile memory card includes a cover that is hinged to the card to normally cover a set of external contacts to which the memory is connected but which can be rotated out of the way by hand to expose that set of contacts for connection with a mating receptacle of a host device. A second set of electrical contacts having a different pattern than the covered set may also be provided on the card. The covered set of contacts may be in accordance with the universal serial bus (USB) plug standards. A latching mechanism built into the hinged cover holds it firmly in a closed position but allows its manual release to expose the covered set of contacts. One exemplary release mechanism utilizes a resiliently held element that is moveable by hand against the resilience, and another employs a hand slideable latch.
摘要翻译： 封闭的可重新编程的非易失性存储卡包括铰链到卡的盖，以正常覆盖一组外部触点，存储器连接到该外部触点，但是可以用手旋转以露出该组触点 用于与主机设备的配合插座连接。 具有与覆盖组不同的图案的第二组电触点也可以设置在卡上。 覆盖的触点组可能符合通用串行总线（USB）插头标准。 内置在铰链盖中的锁定机构将其牢固地保持在关闭位置，但允许其手动释放以暴露所覆盖的一组触点。 一种示例性的释放机构利用可弹性保持的元件，该元件可用手抵靠弹性移动，另一种采用手动滑动闩锁。
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