发明申请
- 专利标题： Integrated Circuit Stacked Package Precursors and Stacked Packaged Devices and Systems Therefrom
- 专利标题（中）： 集成电路堆叠封装前体和堆叠封装的器件和系统
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申请号： US13244364申请日： 2011-09-24
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公开(公告)号： US20120015478A1公开(公告)日： 2012-01-19
- 发明人: Peter R. Harper , Kenneth Maggio
- 申请人： Peter R. Harper , Kenneth Maggio
- 申请人地址： US TX Dallas
- 专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人地址： US TX Dallas
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/56
摘要：
A package-on-package (POP) package precursor and packaged devices and systems therefrom includes an electronic substrate including electrically conductive layers and a top surface. A first portion of the top surface has an IC die attached thereon. A second portion of the top surface has a plurality of first attach pads on opposing sides of the IC die for electrically coupling to a first electronic device on top of the IC die. At least a third portion of the top surface is positioned laterally with respect to the first and second portion. The third portion includes a plurality of second attach pads for electrically coupling to at least a second electronic device. At least one of the electrically conductive layers includes a coupling trace that couples at least one of the plurality of second attach pads to the IC die and/or one or more of the plurality of first attach pads.
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