Invention Application
US20120018310A1 COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING
审中-公开
金属镀层组合物，用于无电离子特征填充的包含抑制剂的金属镀层
- Patent Title: COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING
- Patent Title (中): 金属镀层组合物，用于无电离子特征填充的包含抑制剂的金属镀层
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Application No.: US13260173Application Date: 2010-03-31
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Publication No.: US20120018310A1Publication Date: 2012-01-26
- Inventor: Cornelia Roeger-Goepfert , Roman Benedikt Raether , Charlotte Emnet , Alexandra Haag , Dieter Mayer
- Applicant: Cornelia Roeger-Goepfert , Roman Benedikt Raether , Charlotte Emnet , Alexandra Haag , Dieter Mayer
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- Priority: EP09157540.7 20090407
- International Application: PCT/EP10/54281 WO 20100331
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D5/02
Abstract:
Composition comprising a source of metal ions and at least one suppressing agent obtainable by reacting a) an amine compound comprising at least three active amino functional groups with b) a mixture of ethylene oxide and at least one compound selected from C3 and C4 alkylene oxides.
Information query
