发明申请
- 专利标题： Method for packaging semiconductor device
- 专利标题（中）： 封装半导体器件的方法
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申请号： US13064646申请日： 2011-04-06
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公开(公告)号： US20120021564A1公开(公告)日： 2012-01-26
- 发明人: Chien-Wen Chen , Longqiang Zu , Chen-Fa Tsai
- 申请人： Chien-Wen Chen , Longqiang Zu , Chen-Fa Tsai
- 申请人地址： TW Hsinchu City
- 专利权人： Global Unichip Corporation
- 当前专利权人： Global Unichip Corporation
- 当前专利权人地址： TW Hsinchu City
- 优先权： TW099124266 20100723
- 主分类号： H01L21/58
- IPC分类号： H01L21/58
摘要：
The present invention provides a method for packaging semiconductor device which is using more than once reflow processes to heat the solder ball to prevent the deformation of solder ball, so that the yield of the manufacturing process can be increased and the reliability of the semiconductor device can be increased.
公开/授权文献
- US08278145B2 Method for packaging semiconductor device 公开/授权日：2012-10-02
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