公开(公告)号：US20120021564A1

公开(公告)日：2012-01-26

申请号：US13064646

申请日：2011-04-06

申请人： Chien-Wen Chen ,  Longqiang Zu ,  Chen-Fa Tsai

发明人： Chien-Wen Chen ,  Longqiang Zu ,  Chen-Fa Tsai

IPC分类号： H01L21/58

CPC分类号： H01L24/92 ,  H01L21/563 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/29147 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/8313 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2224/9211 ,  H01L2224/92225 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/01019 ,  H01L2924/01077 ,  H05K3/3457 ,  H05K3/3494 ,  H05K2201/10159 ,  H05K2201/10674 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： The present invention provides a method for packaging semiconductor device which is using more than once reflow processes to heat the solder ball to prevent the deformation of solder ball, so that the yield of the manufacturing process can be increased and the reliability of the semiconductor device can be increased.

摘要翻译： 本发明提供了一种半导体器件的封装方法，其使用多次回流工艺来加热焊球以防止焊球的变形，从而可以提高制造工艺的成品率，并且半导体器件的可靠性可以 增加。

公开(公告)号：US08976517B2

公开(公告)日：2015-03-10

申请号：US13536496

申请日：2012-06-28

申请人： Wan-Tien Chen ,  Ming-Sheng Chiang ,  Wen-Chang Lu ,  Hung-Yi Tsai ,  Yuan-Chih Tsai ,  Chu-Kuang Tseng ,  Chi-Ming Wu ,  Jen-Shiun Huang ,  Tsung-Ting Lee ,  Chen-Fa Tsai

发明人： Wan-Tien Chen ,  Ming-Sheng Chiang ,  Wen-Chang Lu ,  Hung-Yi Tsai ,  Yuan-Chih Tsai ,  Chu-Kuang Tseng ,  Chi-Ming Wu ,  Jen-Shiun Huang ,  Tsung-Ting Lee ,  Chen-Fa Tsai

IPC分类号： G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  G02F1/1333

CPC分类号： G02F1/133308 ,  G02F2201/503 ,  H05K5/0017

摘要： An electronic device includes a shell, a display module and a cushion. The shell includes a bottom plate and a top plate. The top plate defines an opening. The display module is disposed in the shell and faces the opening. The display module is spaced from the bottom plate of the shell. The cushion is disposed between the display module and the bottom plate of the shell, and brought into contact with the display module for cushioning the display module when an external force is applied to the display module.

摘要翻译： 电子设备包括外壳，显示模块和缓冲垫。 壳体包括底板和顶板。 顶板限定开口。 显示模块设置在壳体中并面向开口。 显示模块与壳体的底板间隔开。 衬垫设置在显示模块和壳体的底板之间，并且当外力对显示模块施加时，与显示模块接触以缓冲显示模块。

公开(公告)号：US06600216B1

公开(公告)日：2003-07-29

申请号：US10138481

申请日：2002-05-06

申请人： Wen-Lo Shieh ,  Chia-Ming Yang ,  Chen-Fa Tsai ,  Shu-Fen Liang ,  Shu-Min Chou

发明人： Wen-Lo Shieh ,  Chia-Ming Yang ,  Chen-Fa Tsai ,  Shu-Fen Liang ,  Shu-Min Chou

IPC分类号： H01L23495

CPC分类号： H01L23/49541 ,  H01L23/49503 ,  H01L24/28 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/078 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： An improved structure of a pin platform of an integrated circuit having a pin platform body including a chip seat and a plurality of leading plates having their end portions being concentrated on the chip seat and the chip seat being connected to the pin platform body via the connection plate, characterized in that the surrounding of the chip seat is provided with a framing side, and the framing side is connected to a connection plate, and the surface of the chip seat is smaller than the connection surface of the IC to be installed, and the size of the framing side is larger than the size of the connection face of the IC. Therefore, a high performance greenery package is obtained and the ground wire of the IC can be soldered to the framing side, which provides a smooth connection and a communication.

摘要翻译： 一种集成电路的销平台的改进结构，其具有包括芯片座的销平台主体和多个前导板，其端部集中在芯片座上，并且芯片座通过连接件连接到销平台主体 其特征在于，芯片座的周围设有框架侧，框架侧连接到连接板，并且芯片座的表面小于要安装的IC的连接表面，并且 框架侧的尺寸大于IC的连接面的尺寸。 因此，获得了高性能的绿色包装，并且IC的接地线可以焊接到框架侧，这提供了平滑的连接和通信。

公开(公告)号：US08278145B2

公开(公告)日：2012-10-02

申请号：US13064646

申请日：2011-04-06

申请人： Chien-Wen Chen ,  Longqiang Zu ,  Chen-Fa Tsai

发明人： Chien-Wen Chen ,  Longqiang Zu ,  Chen-Fa Tsai

IPC分类号： H01L21/44

CPC分类号： H01L24/92 ,  H01L21/563 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/29147 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/8313 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2224/9211 ,  H01L2224/92225 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/01019 ,  H01L2924/01077 ,  H05K3/3457 ,  H05K3/3494 ,  H05K2201/10159 ,  H05K2201/10674 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： The present invention provides a method for packaging semiconductor device which is using more than once reflow processes to heat the solder ball to prevent the deformation of solder ball, so that the yield of the manufacturing process can be increased and the reliability of the semiconductor device can be increased.

公开(公告)号：US08397380B2

公开(公告)日：2013-03-19

申请号：US12730857

申请日：2010-03-24

申请人： Chia-Jen Kao ,  Chen-Fa Tsai ,  Chien-Wen Chen

发明人： Chia-Jen Kao ,  Chen-Fa Tsai ,  Chien-Wen Chen

IPC分类号： H05K3/34

CPC分类号： H01L21/563 ,  H01L23/49816 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/3511 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/0401

摘要： A method of manufacturing an integrated circuit package includes providing a ball grid array (BGA) module including BGA balls on a side of the BGA module; providing a base substrate; and placing the BGA module on the base substrate. The BGA balls are placed between the BGA module and the base substrate. An adhesive is applied between and contacting the BGA module and the base substrate. The adhesive is then cured. The BGA balls are re-flowed after the step of curing the adhesive.

摘要翻译： 制造集成电路封装的方法包括：在BGA模块的一侧提供包括BGA球的球栅阵列（BGA）模块; 提供基底; 并将BGA模块放置在基底基板上。 BGA球放置在BGA模块和基底之间。 粘合剂施加在BGA模块和基底基板之间并与之接触。 然后将粘合剂固化。 在固化粘合剂的步骤之后，BGA球再次流动。

公开(公告)号：US20130027853A1

公开(公告)日：2013-01-31

申请号：US13536496

申请日：2012-06-28

申请人： WAN-TIEN CHEN ,  MING-SHENG CHIANG ,  WEN-CHANG LU ,  HUNG-YI TSAI ,  YUAN-CHIH TSAI ,  CHU-KUANG TSENG ,  CHI-MING WU ,  JEN-SHIUN HUANG ,  TSUNG-TING LEE ,  CHEN-FA TSAI

发明人： WAN-TIEN CHEN ,  MING-SHENG CHIANG ,  WEN-CHANG LU ,  HUNG-YI TSAI ,  YUAN-CHIH TSAI ,  CHU-KUANG TSENG ,  CHI-MING WU ,  JEN-SHIUN HUANG ,  TSUNG-TING LEE ,  CHEN-FA TSAI

IPC分类号： H05K5/00

CPC分类号： G02F1/133308 ,  G02F2201/503 ,  H05K5/0017

摘要： An electronic device includes a shell, a display module and a cushion. The shell includes a bottom plate and a top plate. The top plate defines an opening The display module is disposed in the shell and faces the opening The display module is spaced from the bottom plate of the shell. The cushion is disposed between the display module and the bottom plate of the shell, and brought into contact with the display module for cushioning the display module when an external force is applied to the display module.

摘要翻译： 电子设备包括外壳，显示模块和缓冲垫。 壳体包括底板和顶板。 顶板限定开口显示模块设置在壳体中并面向开口显示模块与壳体的底板间隔开。 衬垫设置在显示模块和壳体的底板之间，并且当外力对显示模块施加时，与显示模块接触以缓冲显示模块。

公开(公告)号：US20100302749A1

公开(公告)日：2010-12-02

申请号：US12730857

申请日：2010-03-24

申请人： Chia-Jen Kao ,  Chen-Fa Tsai ,  Chien-Wen Chen

发明人： Chia-Jen Kao ,  Chen-Fa Tsai ,  Chien-Wen Chen

IPC分类号： H05K7/00 ,  H01R43/00

CPC分类号： H01L21/563 ,  H01L23/49816 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/3511 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/0401

摘要： A method of manufacturing an integrated circuit package includes providing a ball grid array (BGA) module including BGA balls on a side of the BGA module; providing a base substrate; and placing the BGA module on the base substrate. The BGA balls are placed between the BGA module and the base substrate. An adhesive is applied between and contacting the BGA module and the base substrate. The adhesive is then cured. The BGA balls are re-flowed after the step of curing the adhesive.

摘要翻译： 制造集成电路封装的方法包括：在BGA模块的一侧提供包括BGA球的球栅阵列（BGA）模块; 提供基底; 并将BGA模块放置在基底基板上。 BGA球放置在BGA模块和基底之间。 粘合剂施加在BGA模块和基底基板之间并与之接触。 然后将粘合剂固化。 在固化粘合剂的步骤之后，BGA球再次流动。