发明申请
- 专利标题： Hermetic Wafer Level Packaging
- 专利标题（中）： 密封晶圆级包装
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申请号： US12846504申请日： 2010-07-29
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公开(公告)号： US20120025389A1公开(公告)日： 2012-02-02
- 发明人: Richard Chu , Martin Liu , Chia-Hua Chu , Yuan-Chih Hsieh , Chung-Hsien Lin , Lan-Lin Chao , Chun-Wen Cheng , Mingo Liu
- 申请人： Richard Chu , Martin Liu , Chia-Hua Chu , Yuan-Chih Hsieh , Chung-Hsien Lin , Lan-Lin Chao , Chun-Wen Cheng , Mingo Liu
- 申请人地址： TW Hsin-Chu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/50
摘要：
Provided is a wafer level packaging. The packaging includes a first semiconductor wafer having a transistor device and a first bonding layer that includes a first material. The packaging includes a second semiconductor wafer having a second bonding layer that includes a second material different from the first material, one of the first and second materials being aluminum-based, and the other thereof being titanium-based. Wherein a portion of the second wafer is diffusively bonded to the first wafer through the first and second bonding layers.
公开/授权文献
- US08648468B2 Hermetic wafer level packaging 公开/授权日：2014-02-11
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