Invention Application
- Patent Title: FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE
- Patent Title (中): 片状薄膜型半导体背面膜
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Application No.: US13192068Application Date: 2011-07-27
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Publication No.: US20120025404A1Publication Date: 2012-02-02
- Inventor: Goji SHIGA , Naohide TAKAMOTO , Fumiteru ASAI
- Applicant: Goji SHIGA , Naohide TAKAMOTO , Fumiteru ASAI
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Priority: JP2010-169551 20100728
- Main IPC: H01L23/28
- IPC: H01L23/28 ; B32B7/12 ; H01L21/56
Abstract:
The present invention relates to a film for flip chip type semiconductor back surface to be formed on the back surface of a semiconductor element flip chip-connected to an adherend, the film for flip chip type semiconductor back surface having a tensile storage elastic modulus at 25° C. after thermal curing within a range of from 10 GPa to 30 GPa, in which the tensile storage elastic modulus at 25° C. after thermal curing of the film for flip chip type semiconductor back surface falls within a range of from 4 times to 20 times the tensile storage elastic modulus at 25° C. before thermal curing thereof.
Public/Granted literature
- US08450189B2 Film for flip chip type semiconductor back surface Public/Granted day:2013-05-28
Information query
IPC分类:
