公开(公告)号：US09074113B2

公开(公告)日：2015-07-07

申请号：US13184994

申请日：2011-07-18

Applicant: Naohide Takamoto ,  Goji Shiga ,  Fumiteru Asai

Inventor： Naohide Takamoto ,  Goji Shiga ,  Fumiteru Asai

IPC: H01L23/48 ,  C09J163/00

CPC classification number: C09J163/00 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected to an adherend, the film for flip chip type semiconductor back surface containing an inorganic filler in an amount within a range of 70% by weight to 95% by weight based on the whole of the film for flip chip type semiconductor back surface.

Abstract translation: 本发明涉及一种用于倒装芯片型半导体背表面的薄膜，该薄膜形成在与被粘物相连的半导体元件倒装芯片的背面上，所述薄膜半导体背面的薄膜包含无机填料的量 基于用于倒装芯片型半导体背表面的整个膜的70重量％至95重量％的范围。

公开(公告)号：US08704382B2

公开(公告)日：2014-04-22

申请号：US12975893

申请日：2010-12-22

Applicant: Naohide Takamoto ,  Takeshi Matsumura ,  Goji Shiga

Inventor： Naohide Takamoto ,  Takeshi Matsumura ,  Goji Shiga

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L21/6836 ,  H01L21/561 ,  H01L23/3164 ,  H01L23/544 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/8101 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/814 ,  H01L2224/831 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/3025 ,  Y10T428/28 ,  H01L2924/014 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention provides a film for flip chip type semiconductor back surface, which is to be formed on a back surface of a semiconductor element flip-chip connected on an adherend, the film including a wafer adhesion layer and a laser marking layer, in which the wafer adhesion layer has a light transmittance of 40% or more in terms of a light having a wavelength of 532 nm and the laser marking layer has a light transmittance of less than 40% in terms of a light having a wavelength of 532 nm.

Abstract translation: 本发明提供了一种用于倒装芯片型半导体背表面的薄膜，其将形成在连接在被粘物上的半导体元件倒装芯片的背面上，该薄膜包括晶片粘合层和激光标记层，其中 晶片粘合层的波长为532nm的光的透光率为40％以上，激光标记层的波长为532nm的光的透光率为40％以下。

公开(公告)号：US08692389B2

公开(公告)日：2014-04-08

申请号：US12976112

申请日：2010-12-22

Applicant: Naohide Takamoto ,  Takeshi Matsumura ,  Goji Shiga

Inventor： Naohide Takamoto ,  Takeshi Matsumura ,  Goji Shiga

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L23/562 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3164 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/81 ,  H01L2221/68377 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16221 ,  H01L2224/274 ,  H01L2224/73204 ,  H01L2224/81007 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3025 ,  Y10T428/1476 ,  Y10T428/28 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/3512 ,  H01L2924/00

Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which a peel force (temperature: 23° C., peeling angle: 180°, tensile rate: 300 mm/min) between the pressure-sensitive adhesive layer of the dicing tape and the film for flip chip type semiconductor back surface is from 0.05 N/20 mm to 1.5 N/20 mm.

Abstract translation: 本发明提供一种半导体背面用切割带一体膜，其特征在于，包括：基材的切割带和设置在基材上的粘合剂层; 以及设置在压敏粘合剂层上的倒装芯片型半导体背面的膜，其中压敏粘合剂层之间的剥离力（温度：23℃，剥离角度：180°，拉伸速度：300mm / min） 切割带的粘合剂层和倒装芯片型半导体背面的膜的厚度为0.05N / 20mm至1.5N / 20mm。

公开(公告)号：US08652938B2

公开(公告)日：2014-02-18

申请号：US13190664

申请日：2011-07-26

Applicant: Naohide Takamoto ,  Goji Shiga ,  Fumiteru Asai

Inventor： Naohide Takamoto ,  Goji Shiga ,  Fumiteru Asai

IPC: H01L21/00

CPC classification number: C09J5/06 ,  C09J7/22 ,  C09J7/29 ,  C09J7/38 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/11 ,  C09J2205/302 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81911 ,  H01L2224/83104 ,  H01L2924/10253 ,  Y10T428/25 ,  Y10T428/31504 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00

Abstract: The present invention relates to a thermally releasable sheet-integrated film for semiconductor back surface, which includes: a pressure-sensitive adhesive sheet including a base material layer and a pressure-sensitive adhesive layer, and a film for semiconductor back surface formed on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet, in which the pressure-sensitive adhesive sheet is a thermally releasable pressure-sensitive adhesive sheet whose peel force from the film for semiconductor back surface decreases upon heating.

Abstract translation: 本发明涉及一种用于半导体背表面的可热分解的片状集成膜，其包括：包含基材层和压敏粘合剂层的压敏粘合片，以及在压力下形成的半导体背面的膜 粘合片的粘合片的粘合剂层，其中粘合片是其半导体背面的膜的剥离力在加热时降低的可热剥离的压敏粘合片。

公开(公告)号：US20130122688A1

公开(公告)日：2013-05-16

申请号：US13811570

申请日：2012-07-02

Applicant: Takatoshi Sasaki ,  Koji Mizuno ,  Fumiteru Asai ,  Goji Shiga

Inventor： Takatoshi Sasaki ,  Koji Mizuno ,  Fumiteru Asai ,  Goji Shiga

IPC: H01L21/78

CPC classification number: H01L21/78 ,  C08K5/005 ,  C09J7/38 ,  C09J11/06 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  H01L21/6836 ,  H01L2221/68336 ,  Y10T428/28 ,  Y10T428/2848

Abstract: An object of the present invention is to provide a pressure-sensitive adhesive sheet for dicing that is capable of preventing scratching of an adsorption stage when laser-scribing a semiconductor wafer. Provided is a pressure-sensitive adhesive sheet for dicing having a base and a pressure-sensitive adhesive layer provided on the base, in which 0.02 to 5 parts by weight of an ultraviolet absorber is contained in the pressure-sensitive adhesive layer with respect to 100 parts by weight of resin solid content, and in which the light transmittance at a wavelength of 355 nm of the pressure-sensitive adhesive sheet for dicing is 30% to 80%.

Abstract translation: 本发明的目的是提供一种用于切割的压敏粘合片，其能够在激光刻划半导体晶片时能够防止吸附阶段的刮擦。 提供一种用于切割的压敏粘合片，其具有设置在基底上的基底和压敏粘合剂层，其中压敏粘合剂层中含有0.02至5重量份的紫外线吸收剂相对于100 树脂固体成分重量份，切割用粘合片的波长355nm的透光率为30〜80％。

公开(公告)号：US08404522B2

公开(公告)日：2013-03-26

申请号：US13172945

申请日：2011-06-30

Applicant: Goji Shiga ,  Naohide Takamoto ,  Fumiteru Asai

Inventor： Goji Shiga ,  Naohide Takamoto ,  Fumiteru Asai

IPC: H01L21/00

CPC classification number: H01L21/6836 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/3164 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68386 ,  H01L2223/54433 ,  H01L2223/54473 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/15788 ,  Y10T428/24959 ,  Y10T428/265 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/00

Abstract: The present invention relates to a dicing tape-integrated film for semiconductor back surface including: a dicing tape including a base material and a pressure-sensitive adhesive layer laminated in this order, and a film for semiconductor back surface provided on the pressure-sensitive adhesive layer of the dicing tape, where the pressure-sensitive adhesive layer has a thickness of from 20 μm to 40 μm.

Abstract translation: 本发明涉及一种半导体背面用切割带一体化膜，其特征在于，具有：依次层叠有基材和粘合剂层的切割带和设置在所述压敏粘合剂上的半导体背面用膜 切割胶带的层，其中压敏粘合剂层的厚度为20μm至40μm。

公开(公告)号：US20120028415A1

公开(公告)日：2012-02-02

申请号：US13172945

申请日：2011-06-30

Applicant: Goji SHIGA ,  Naohide TAKAMOTO ,  Fumiteru ASAI

Inventor： Goji SHIGA ,  Naohide TAKAMOTO ,  Fumiteru ASAI

IPC: H01L21/78 ,  B32B7/02 ,  B32B3/00

CPC classification number: H01L21/6836 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/3164 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68386 ,  H01L2223/54433 ,  H01L2223/54473 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/15788 ,  Y10T428/24959 ,  Y10T428/265 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/00

Abstract: The present invention relates to a dicing tape-integrated film for semiconductor back surface including: a dicing tape including a base material and a pressure-sensitive adhesive layer laminated in this order, and a film for semiconductor back surface provided on the pressure-sensitive adhesive layer of the dicing tape, where the pressure-sensitive adhesive layer has a thickness of from 20 μm to 40 μm.

Abstract translation: 本发明涉及一种半导体背面用切割带一体化膜，其特征在于，具有：依次层叠有基材和粘合剂层的切割带和设置在所述压敏粘合剂上的半导体背面用膜 切割胶带的层，其中压敏粘合剂层的厚度为20μm至40μm。

公开(公告)号：US20120024469A1

公开(公告)日：2012-02-02

申请号：US13170581

申请日：2011-06-28

Applicant: Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI

Inventor： Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI

IPC: H01L21/02 ,  B32B38/04 ,  B32B38/10 ,  B65D65/28

CPC classification number: H01L21/6836 ,  B32B37/1284 ,  B32B38/0004 ,  B32B38/10 ,  B32B2405/00 ,  B32B2457/14 ,  C09J7/20 ,  C09J165/00 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2223/54406 ,  H01L2223/5442 ,  H01L2223/5448 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/73204 ,  H01L2224/81095 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92125 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/15788 ,  Y10T156/1052 ,  Y10T156/1064 ,  Y10T156/1075 ,  Y10T156/1077 ,  Y10T156/1082 ,  Y10T156/1093 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/1495 ,  Y10T428/15 ,  Y10T428/21 ,  H01L21/78 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2224/13099

Abstract: The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ⅔ of the thickness of the separator.

Abstract translation: 本发明涉及一种用于半导体器件生产的膜，其包括：隔板; 以及多个粘附层附着的切割带，每个粘合剂层附着的切割带包括层合在切割带上的切割带和粘合剂层，它们以预定的间隔层压在隔板上，使得粘合剂层附着到隔板上，其中 分离器具有沿着切割带的外周形成的切口，并且切割深度为隔板的厚度的至多。。

公开(公告)号：US20120018903A1

公开(公告)日：2012-01-26

申请号：US13186000

申请日：2011-07-19

Applicant: Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI

Inventor： Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI

IPC: H01L23/48 ,  B32B3/00 ,  H01L21/50

CPC classification number: H01L21/6835 ,  C09J163/00 ,  H01L21/561 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3157 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2223/54406 ,  H01L2223/54413 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16258 ,  H01L2224/16268 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81002 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/831 ,  H01L2224/83862 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/15788 ,  Y10T428/24802 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2224/13099

Abstract: The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, the film having a light transmittance at a wavelength of 532 nm or 1064 nm of 20% or less, and having a contrast between a marking part and a part other than the marking part after laser marking of 20% or more.

Abstract translation: 本发明涉及一种用于倒装芯片型半导体背表面的薄膜，该薄膜形成在连接到被粘物上的半导体元件倒装芯片的背面上，该膜具有波长为532nm或1064nm的透光率为20 ％以下，并且在激光标记20％以上之后，标记部与标记部以外的部分之间具有对比度。

公开(公告)号：US20110156277A1

公开(公告)日：2011-06-30

申请号：US12975641

申请日：2010-12-22

Applicant: Naohide TAKAMOTO ,  Takeshi MATSUMURA ,  Goji SHIGA

Inventor： Naohide TAKAMOTO ,  Takeshi MATSUMURA ,  Goji SHIGA

IPC: H01L23/48 ,  H01L21/50 ,  B32B7/12

CPC classification number: H01L21/6836 ,  H01L21/67132 ,  H01L23/562 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68377 ,  H01L2224/81201 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00

Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface contains a black pigment.

Abstract translation: 本发明提供一种半导体背面用切割带一体膜，其特征在于，包括：基材的切割带和设置在基材上的粘合剂层; 以及用于倒装芯片型半导体背面的膜包含黑色颜料的压敏粘合剂层上的倒装芯片型半导体背面的膜。