Invention Application
US20120027948A1 COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING
审中-公开
金属镀层组合物，用于无电离子特征填充的包含抑制剂
- Patent Title: COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING
- Patent Title (中): 金属镀层组合物，用于无电离子特征填充的包含抑制剂
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Application No.: US13259482Application Date: 2010-03-29
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Publication No.: US20120027948A1Publication Date: 2012-02-02
- Inventor: Cornelia Roeger-Goepfert , Roman Benedikt Raether , Charlotte Emnet , Alexandra Haag , Dieter Mayer
- Applicant: Cornelia Roeger-Goepfert , Roman Benedikt Raether , Charlotte Emnet , Alexandra Haag , Dieter Mayer
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- Priority: EP09157542.3 20090407
- International Application: PCT/EP2010/054108 WO 20100329
- Main IPC: B05D1/18
- IPC: B05D1/18 ; B05D3/14 ; C09D1/00
Abstract:
A composition comprising a source of metal ions and at least one suppressing agent obtainable by reacting a) an amine compound comprising active amino functional groups with b) a mixture of ethylene oxide and at least one compound selected from C3 and C4 alkylene oxides, said suppressing agent having a molecular weight Mw of 6000 g/mol or more.
Information query
