发明申请
- 专利标题: Method for manufacturing multi-layer printed circuit board
- 专利标题(中): 制造多层印刷电路板的方法
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申请号: US13137352申请日: 2011-08-08
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公开(公告)号: US20120030942A1公开(公告)日: 2012-02-09
- 发明人: Yoong Oh , Cheol Ho Choi
- 申请人: Yoong Oh , Cheol Ho Choi
- 申请人地址: KR Suwon
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2010-0076426 20100809
- 主分类号: H05K3/10
- IPC分类号: H05K3/10
摘要:
Disclosed herein is a method for manufacturing a multi-layer printed circuit board. The method for manufacturing the multi-layer printed circuit board according to an exemplary embodiment of the present invention includes manufacturing a core substrate on which circuit patterns are formed by patterning copper clads on both sides thereof; laminating insulating films on top and bottom surfaces of the core substrate; and stacking the copper clads provided with bumps on the top and bottom surfaces of the core substrate, respectively, on which the insulating films are laminated.
公开/授权文献
- US09060458B2 Method for manufacturing multi-layer printed circuit board 公开/授权日:2015-06-16