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    Apparatus for manufacturing printed circuit board
    2.
    发明申请
    Apparatus for manufacturing printed circuit board 审中-公开
    印刷电路板制造装置

    公开(公告)号：US20110132546A1

    公开(公告)日：2011-06-09

    申请号：US12659029

    申请日：2010-02-23

    申请人： Yoong Oh ,  Dek Gin Yang

    发明人： Yoong Oh ,  Dek Gin Yang

    IPC分类号： B32B38/14 ,  B32B37/02 ,  B32B38/04

    CPC分类号： B32B38/1816 ,  B32B38/0004 ,  B32B38/145 ,  B32B39/00 ,  B32B2457/08 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

    摘要： Disclosed is an apparatus for manufacturing a printed circuit board. The apparatus for manufacturing the printed circuit board includes: a supplier for supplying a substrate of a sheet type; a first printer for printing paste on the substrate supplied from the supplier to thereby form preliminary bumps; a provisional dryer which is arranged on one side of the first printer and provisional-dries the preliminary bumps; a second printer which is arranged on one side of the provisional dryer to be in series to the first printer and prints paste on the preliminary bumps; a dryer which is arranged on one side of the second printer and dries and cures the preliminary bumps to thereby form bumps; and a penetrator which is arranged on one side of the dryer, and allows the bump to pass through prepreg and bonds the prepreg and the substrate together.

    摘要翻译： 公开了一种印刷电路板的制造装置。 用于制造印刷电路板的装置包括：用于供应片状基板的供应商; 第一打印机，用于在从供应商供应的基板上印刷浆料，从而形成初步凸块; 临时干燥器，布置在第一打印机的一侧并对初步凸块进行暂时干燥; 第二打印机，其布置在所述临时干衣机的一侧以与所述第一打印机串联，并且在所述预备凸块上印刷浆料; 布置在第二打印机的一侧的干衣机，干燥并固化预备凸块从而形成凸块; 以及布置在干燥器的一侧的穿透器，并且允许凸块穿过预浸料并将预浸料和基材粘合在一起。

    Printed circuit board using paste bump and manufacturing method thereof
    3.
    发明申请
    Printed circuit board using paste bump and manufacturing method thereof 有权
    使用糊状凸块的印刷电路板及其制造方法

    公开(公告)号：US20080283288A1

    公开(公告)日：2008-11-20

    申请号：US12219381

    申请日：2008-07-21

    申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    IPC分类号： H05K1/11

    CPC分类号： H05K3/462 ,  H01R12/523 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0353 ,  Y10T29/49155

    摘要： A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

    摘要翻译： 公开了一种使用糊状凸块的印刷电路板及其制造方法。 使用糊状凸块制造印刷电路板的方法包括：（a）穿孔芯板以形成至少一个通孔，（b）通过填充电镀填充至少一个通孔并在其上形成电路图案 芯板的至少一个表面，（c）在芯板的至少一个表面上堆叠焊料凸块，以及（d）在焊料凸块的表面上形成外层电路，结构稳定的全层 由于镀层芯板的BVH的强度增加，可以实现IVH结构，由于并行处理和集体堆叠，制造时间可以减少，由于糊状凸块的铜箔堆叠而实现微电路变得容易 在最外层，可以减少制造成本，因为可以省略某些电镀和钻孔工艺，在电路图案之间增加层间连接面积以提高连接可靠性，并且可以获得凹坑覆盖 d。

    Printed circuit board using paste bump and manufacturing method thereof
    4.
    发明授权
    Printed circuit board using paste bump and manufacturing method thereof 有权
    使用糊状凸块的印刷电路板及其制造方法

    公开(公告)号：US07973248B2

    公开(公告)日：2011-07-05

    申请号：US12219381

    申请日：2008-07-21

    申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    IPC分类号： H01R12/04 ,  H05K1/11

    CPC分类号： H05K3/462 ,  H01R12/523 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0353 ,  Y10T29/49155

    摘要： A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

    摘要翻译： 公开了一种使用糊状凸块的印刷电路板及其制造方法。 使用糊状凸块制造印刷电路板的方法包括：（a）穿孔芯板以形成至少一个通孔，（b）通过填充电镀填充至少一个通孔并在其上形成电路图案 芯板的至少一个表面，（c）在芯板的至少一个表面上堆叠焊料凸块，以及（d）在焊料凸块的表面上形成外层电路，结构稳定的全层 由于镀层芯板的BVH的强度增加，可以实现IVH结构，由于并行处理和集体堆叠，制造时间可以减少，由于粘贴凸块的铜箔堆叠而实现微电路变得容易 在最外层，可以减少制造成本，因为可以省略某些电镀和钻孔工艺，在电路图案之间增加层间连接面积以提高连接可靠性，并且可以获得凹坑覆盖 d。

    Printed circuit board and manufacturing method thereof
    6.
    发明申请
    Printed circuit board and manufacturing method thereof 审中-公开
    印刷电路板及其制造方法

    公开(公告)号：US20120103662A1

    公开(公告)日：2012-05-03

    申请号：US13064331

    申请日：2011-03-18

    申请人： Chang Bo Lee ,  Cheol Ho Choi ,  Yoong Oh

    发明人： Chang Bo Lee ,  Cheol Ho Choi ,  Yoong Oh

    IPC分类号： H05K1/02 ,  B05D5/00 ,  H05K3/10 ,  H05K3/22

    CPC分类号： H05K3/3452 ,  H05K3/3436 ,  H05K2203/0278 ,  H05K2203/1476 ,  Y10T29/49155 ,  Y10T156/10

    摘要： Disclosed herein are a printed circuit board including a first low-viscosity solder resist layer formed on one surface of a substrate having circuit patterns formed thereon and a second high-viscosity solder resist layer stacked on the first solder resist layer, thereby being advantageous in controlling the deviation in application thickness of solder resist (SR), while having excellent adhesion to the substrate, and a manufacturing method thereof.

    摘要翻译： 这里公开了一种印刷电路板，其包括形成在其上形成有电路图案的基板的一个表面上的第一低粘度阻焊层和堆叠在第一阻焊层上的第二高粘度阻焊层，由此有利于控制 阻焊剂（SR）的应用厚度的偏差，同时对基板具有优异的粘附性及其制造方法。

    APPARATUS AND METHOD FOR COATING
    7.
    发明申请
    APPARATUS AND METHOD FOR COATING 审中-公开
    装置和涂层方法

    公开(公告)号：US20120034386A1

    公开(公告)日：2012-02-09

    申请号：US13196777

    申请日：2011-08-02

    申请人： Yoong Oh ,  Jong-Seok Bae

    发明人： Yoong Oh ,  Jong-Seok Bae

    IPC分类号： B05D3/12 ,  B05C11/04

    CPC分类号： B05D1/28 ,  B05C1/08 ,  B05C11/044 ,  B05D1/42

    摘要： An apparatus and a method for coating are disclosed. The coating apparatus of the present invention, which include: a transporting part configured to transport a substrate; a coating part configured to coat a coating material on the substrate; and a squeegee installed to remove an excessive coating material after the substrate passes through the coating part and being moveable along a transporting path of the substrate, can carry out the coating operation and the squeegeeing operation together, thereby reducing the lead time of the coating operation of the substrate and increasing the productivity. By integrating the conventional coating device and squeegeeing device, the space required for installation can be saved, and the quality of coating can be improved because conditions for coating can be adjusted.

    摘要翻译： 公开了一种涂布装置和方法。 本发明的涂布装置，其特征在于，包括：输送部，其构造成输送基板; 被配置为涂覆所述基板上的涂层材料的涂层部分; 以及在基板通过涂布部分并且可沿着基板的传送路径移动之后安装用于去除过量涂层材料的刮板，可以一起执行涂布操作和刮涂操作，从而减少涂布操作的前置时间 并提高生产率。 通过集成传统的涂布装置和刮板装置，可以节省安装所需的空间，并且可以调节涂层的条件来改善涂层的质量。

    Method for fabricating core substrate using paste bumps
    10.
    发明授权
    Method for fabricating core substrate using paste bumps 失效
    使用糊状凸块制造芯基板的方法

    公开(公告)号：US07622329B2

    公开(公告)日：2009-11-24

    申请号：US11602332

    申请日：2006-11-21

    申请人： Yoong Oh ,  Chang-Sup Ryu ,  Dong-Jin Park ,  Jee-Soo Mok ,  Byung-Bae Seo

    发明人： Yoong Oh ,  Chang-Sup Ryu ,  Dong-Jin Park ,  Jee-Soo Mok ,  Byung-Bae Seo

    IPC分类号： H01L21/00 ,  H01L23/48

    CPC分类号： H01L21/486 ,  H01L21/4867 ,  H01L23/49827 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2203/063 ,  H05K2203/1572 ,  H01L2924/00

    摘要： A core substrate and multilayer printed circuit board using paste bumps and manufacturing method thereof are disclosed. With the method of manufacturing a core substrate using paste bumps comprising: (a) aligning a pair of paste bump boards, each of which has a plurality of paste bumps joined to its surface, such that the paste bumps face each other, and (b) pressing the pair of paste bump boards together, where an insulation element is placed between the pair of paste bump boards, it is easier to implement interlayer electrical interconnection between circuit patterns, the thickness of the core substrate can readily be adjusted by adjusting the thickness of the insulation layer, the stiffness is improved as a pair of paste bump boards are pressed from the top and bottom, and high-density wiring can be formed more easily as the paste bumps are connected in pairs so that the diameters of the paste bumps formed on the paste bump boards can be reduced.

    摘要翻译： 公开了一种使用糊状凸块的芯基板和多层印刷电路板及其制造方法。 利用使用糊状凸块的芯基板的制造方法，其特征在于，包括：（a）对准一对粘贴凸块，其中，每一个均具有与其表面接合的多个焊料凸块，使得所述焊膏凸起彼此面对;以及（b ）将一对焊膏凸块按压在一起，其中绝缘元件放置在一对焊膏凸块之间，更容易实现电路图案之间的层间电互连，通过调节厚度可以容易地调节芯基板的厚度 的绝缘层，由于从顶部和底部按压一对糊状凸块，刚度得以改善，并且随着糊料凸块成对连接，可以更容易地形成高密度布线，使得糊料凸块的直径 可以减少形成在糊状凸块上。