发明申请
- 专利标题： SEMICONDUCTOR DEVICE
- 专利标题（中）： 半导体器件
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申请号： US13274971申请日： 2011-10-17
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公开(公告)号： US20120032353A1公开(公告)日： 2012-02-09
- 发明人: Yutaka KAGAYA , Fumitomo WATANABE , Hajime TAKASAKI
- 申请人： Yutaka KAGAYA , Fumitomo WATANABE , Hajime TAKASAKI
- 申请人地址： JP Tokyo
- 专利权人： ELPIDA MEMORY, INC.
- 当前专利权人： ELPIDA MEMORY, INC.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2007-210673 20070813
- 主分类号： H01L23/488
- IPC分类号： H01L23/488
摘要：
A semiconductor device includes a wiring board having connection pads thereon and a semiconductor chip mounted on the wiring board. The wiring board and the semiconductor chip are covered with a sealing portion. Conductive members are extended upward from the connection pads and are exposed from the sealing portion. Rewiring lines are connected to the exposed conductive members. Land portions are arranged on the sealing portion and are electrically connected to the conductive members through the rewiring lines.
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