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公开(公告)号：US20120032353A1
公开(公告)日：2012-02-09
申请号：US13274971
申请日：2011-10-17
IPC分类号： H01L23/488
CPC分类号： H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/105 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48599 , H01L2224/49171 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19107 , H01L2224/83 , H01L2224/85 , H01L2224/82 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor device includes a wiring board having connection pads thereon and a semiconductor chip mounted on the wiring board. The wiring board and the semiconductor chip are covered with a sealing portion. Conductive members are extended upward from the connection pads and are exposed from the sealing portion. Rewiring lines are connected to the exposed conductive members. Land portions are arranged on the sealing portion and are electrically connected to the conductive members through the rewiring lines.
摘要翻译： 半导体器件包括其上具有连接焊盘的布线板和安装在布线板上的半导体芯片。 接线板和半导体芯片被密封部分覆盖。 导电构件从连接垫向上延伸并从密封部分露出。 再生线连接到暴露的导电构件。 接地部设置在密封部上，并通过再布线与导电部件电连接。
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公开(公告)号：US20090045497A1
公开(公告)日：2009-02-19
申请号：US12190010
申请日：2008-08-12
CPC分类号： H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/105 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48599 , H01L2224/49171 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19107 , H01L2224/83 , H01L2224/85 , H01L2224/82 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor device includes a wiring board having connection pads thereon and a semiconductor chip mounted on the wiring board. The wiring board and the semiconductor chip are covered with a sealing portion. Conductive members are extended upward from the connection pads and are exposed from the sealing portion. Rewiring lines are connected to the exposed conductive members. Land portions are arranged on the sealing portion and are electrically connected to the conductive members through the rewiring lines.
摘要翻译： 半导体器件包括其上具有连接焊盘的布线板和安装在布线板上的半导体芯片。 接线板和半导体芯片被密封部分覆盖。 导电构件从连接垫向上延伸并从密封部分露出。 再生线连接到暴露的导电构件。 接地部设置在密封部上，并通过再布线与导电部件电连接。
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