发明申请
- 专利标题: BACKSIDE ILLUMINATED IMAGE SENSOR WITH STRESSED FILM
- 专利标题(中): 带压片的背面照明图像传感器
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申请号: US12853803申请日: 2010-08-10
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公开(公告)号: US20120038014A1公开(公告)日: 2012-02-16
- 发明人: Hsin-Chih Tai , Howard E. Rhodes , Wei Zheng , Vincent Venezia , Yin Qian , Duli Mao
- 申请人: Hsin-Chih Tai , Howard E. Rhodes , Wei Zheng , Vincent Venezia , Yin Qian , Duli Mao
- 申请人地址: US CA Santa Clara
- 专利权人: OMNIVISION TECHNOLOGIES, INC.
- 当前专利权人: OMNIVISION TECHNOLOGIES, INC.
- 当前专利权人地址: US CA Santa Clara
- 主分类号: H01L27/146
- IPC分类号: H01L27/146 ; H01L31/0216
摘要:
A backside illuminated (“BSI”) complementary metal-oxide semiconductor (“CMOS”) image sensor includes a photosensitive region disposed within a semiconductor layer and a stress adjusting layer. The photosensitive region is sensitive to light incident on a backside of the BSI CMOS image sensor to collect an image charge. The stress adjusting layer is disposed on a backside of the semiconductor layer to establish a stress characteristic that encourages photo-generated charge carriers to migrate towards the photosensitive region.
公开/授权文献
- US08338856B2 Backside illuminated image sensor with stressed film 公开/授权日:2012-12-25
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