发明申请
US20120038042A1 LEAD-FREE SOLDER ALLOY, SOLDER BALL, AND ELECTRONIC MEMBER COMPRISING SOLDER BUMP
审中-公开
无铅焊接合金，焊枪和电子元件，包括焊锡膏
- 专利标题： LEAD-FREE SOLDER ALLOY, SOLDER BALL, AND ELECTRONIC MEMBER COMPRISING SOLDER BUMP
- 专利标题（中）： 无铅焊接合金，焊枪和电子元件，包括焊锡膏
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申请号： US13264625申请日： 2010-04-12
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公开(公告)号： US20120038042A1公开(公告)日： 2012-02-16
- 发明人: Tsutomu Sasaki , Shinichi Terashima , Masamoto Tanaka , Katsuichi Kimura
- 申请人： Tsutomu Sasaki , Shinichi Terashima , Masamoto Tanaka , Katsuichi Kimura
- 申请人地址： JP Saitama JP Tokyo
- 专利权人： Nippon Micrometal Corporation,Nippon Steel Materials Co., Ltd.
- 当前专利权人： Nippon Micrometal Corporation,Nippon Steel Materials Co., Ltd.
- 当前专利权人地址： JP Saitama JP Tokyo
- 优先权： JP2009-097647 20090414
- 国际申请： PCT/JP2010/056521 WO 20100412
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; C22C13/02 ; C22C30/02 ; C22C30/04 ; C22C13/00
摘要：
A lead-free solder alloy, a solder ball and an electronic member comprising a solder bump which enable the prevention of the occurrence of yellow discoloration on the surface of a solder after soldering, the surface of a solder bump after the formation of the bump in a BGA, and the surface of a solder bump after a burn-in test of a BGA. Specifically disclosed are: a lead-free solder alloy; a solder ball; and an electronic member comprising a solder bump, containing at least one additive element selected from Li, Na, K, Ca, Be, Mg, Sc, Y, lanthanoid series elements, Ti, Zr, Hf, Nb, Ta, Mo, Zn, Al, Ga, In, Si and Mn in the total amount of 1 ppm by mass to 0.1% by mass inclusive, with the remainder being 40% by mass or more of Sn.
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