发明申请
US20120043886A1 Integrated Heat Conductive Light Emitting Diode (LED) White Light Source Module
审中-公开
集成导热发光二极管（LED）白光源模块
- 专利标题： Integrated Heat Conductive Light Emitting Diode (LED) White Light Source Module
- 专利标题（中）： 集成导热发光二极管（LED）白光源模块
-
申请号： US13098797申请日： 2011-05-02
-
公开(公告)号： US20120043886A1公开(公告)日： 2012-02-23
- 发明人: Hua Ji , Robert Nail Lee
- 申请人： Hua Ji , Robert Nail Lee
- 主分类号： H01J7/44
- IPC分类号： H01J7/44 ; H01J7/24
摘要：
This invention discloses a new and advanced light emitting diodes (LEDs) light source module, and more specifically surface mounting LED dice and/or driver circuits on a slim linear Silicon wafer to provide superior heat dissipation capability through eutectic bonding onto a small Silicon base and the overall performance/cost ratio of the LED white light source module by an advanced integrated.
信息查询
