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Invention Application
US20120047727A1 FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
FLEX-RIGID接线板及其制造方法

  • Patent Title: FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
  • Patent Title (中): FLEX-RIGID接线板及其制造方法
  • Application No.: US13291134
    Application Date: 2011-11-08
  • Publication No.: US20120047727A1
    Publication Date: 2012-03-01
  • Inventor: Michimasa TAKAHASHI
  • Applicant: Michimasa TAKAHASHI
  • Applicant Address: JP Ogaki-shi
  • Assignee: IBIDEN CO., LTD.
  • Current Assignee: IBIDEN CO., LTD.
  • Current Assignee Address: JP Ogaki-shi
  • Main IPC: H05K3/36
  • IPC: H05K3/36
FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
Abstract:
A method for manufacturing a flex-rigid wiring board, including preparing a flexible wiring board having a flexible base material and having a conductive layer over the flexible base material, making a cut in the flexible wiring board to form a cut portion, and folding at least one portion of the flexible wiring board using the cut portion to form one or more folding portions such that the flexible wiring board is extended in length, and connecting the flexible wiring board to a rigid wiring board including a rigid base material and having a conductive layer over the rigid base material.
Abstract(Chinese):

一种柔性刚性布线板的制造方法，其特征在于，在柔性基材上形成具有柔性基材的柔性布线基板，并且在柔性基材上形成导电层，在柔性布线基板上切断，形成切断部， 使用所述切割部分的所述柔性布线板的至少一部分形成一个或多个折叠部分，使得所述柔性布线板的长度延伸，并且将所述柔性布线板连接到包括刚性基底材料并具有导电性的刚性布线板 层叠在刚性基材上。

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