公开(公告)号：US09040837B2

公开(公告)日：2015-05-26

申请号：US13665550

申请日：2012-10-31

申请人： Michimasa Takahashi ,  Teruyuki Ishihara

发明人： Michimasa Takahashi ,  Teruyuki Ishihara

IPC分类号： H05K1/03 ,  H05K3/36 ,  H05K3/46 ,  H05K1/14

CPC分类号： H05K1/0298 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/111 ,  H05K1/115 ,  H05K1/141 ,  H05K1/144 ,  H05K1/182 ,  H05K3/368 ,  H05K3/46 ,  H05K3/4691 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T156/10

摘要： A wiring board includes a first multilayer wiring board having first conductive layers and having a surface, a second multilayer wiring board having second conductive layers and positioned such that the second multilayer wiring board has a surface facing the surface of the first multilayer wiring board, and an adhesive layer including an adhesive sheet and interposed between the first multilayer wiring board and the second multilayer wiring board such that the adhesive layer is adhering the first multilayer wiring board and the second multilayer wiring board. The first multilayer wiring board has a first pad on the surface of the first multilayer wiring board, the second multilayer wiring board has a second pad on the surface of the second multilayer wiring board, and the first pad and the second pad are positioned such that the first pad and the second pad face each other across the adhesive layer.

摘要翻译： 布线基板包括具有第一导电层并具有表面的第一多层布线板，具有第二导电层的第二多层布线板并且定位成使得第二多层布线板具有面向第一多层布线板的表面的表面，以及 粘合剂层，其包括粘合剂片，并且介于所述第一多层布线板和所述第二多层布线板之间，使得所述粘合剂层粘合所述第一多层布线板和所述第二多层布线板。 第一多层布线板在第一多层布线板的表面上具有第一焊盘，第二多层布线板在第二多层布线板的表面上具有第二焊盘，第一焊盘和第二焊盘定位成使得 第一垫和第二垫彼此面对粘合剂层。

公开(公告)号：US08925194B2

公开(公告)日：2015-01-06

申请号：US13219169

申请日：2011-08-26

申请人： Michimasa Takahashi ,  Masakazu Aoyama

发明人： Michimasa Takahashi ,  Masakazu Aoyama

IPC分类号： H01K3/10 ,  H05K3/00 ,  H01L23/02 ,  H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  H05K1/02

CPC分类号： H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/4652 ,  H05K3/4664 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  Y10T29/49124 ,  Y10T29/49165

摘要： A method of manufacturing a flex-rigid wiring board includes disposing a non-flexible substrate and a flexible board side by side in the horizontal direction of the substrate and board such that an end of the substrate is positioned adjacent to an end of the board and forms boundary between the board and the substrate with respect to the end of the board, covering the boundary between the board and the substrate with an insulating layer such that the insulating layer is positioned on the board and the substrate across the boundary, forming a second conductor pattern on the insulating layer, forming a via hole which passes through the insulating layer and reaches a first conductor pattern of the board, and plating the via hole such that a via conductor connecting the first and second patterns. The flexible board includes a flexible substrate and the first pattern formed over the substrate.

摘要翻译： 制造柔性刚性布线板的方法包括在基板和板的水平方向上并排设置非柔性基板和柔性基板，使得基板的端部邻近板的端部定位， 在板和基板之间形成相对于板的端部的边界，用绝缘层覆盖板和基板之间的边界，使得绝缘层位于板上并且基板跨越边界，形成第二个 形成绝缘层上的导体图案，形成穿过绝缘层并到达板的第一导体图形的通孔，并且对通孔进行电镀，使得连接第一和第二图案的通孔导体。 柔性板包括柔性基板和形成在基板上的第一图案。

公开(公告)号：US08493747B2

公开(公告)日：2013-07-23

申请号：US12949078

申请日：2010-11-18

申请人： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

发明人： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

IPC分类号： H05K1/11

CPC分类号： H05K3/4691 ,  H05K2201/09827 ,  H05K2201/09845 ,  Y10T29/49124 ,  Y10T29/49128

摘要： A flex-rigid wiring board including an insulative substrate, a flexible wiring board positioned beside the insulative substrate, an insulation layer positioned over the insulative substrate and the flexible wiring board and exposing a portion of the flexible wiring board, and a wiring layer made of a conductor and formed on the insulation layer. The insulation layer has a tapered portion which becomes thinner toward an end surface of the insulation layer in the direction of the portion of the flexible wiring board exposed by the insulation layer. The wiring layer has a sloping portion formed on the tapered portion of the insulation layer.

摘要翻译： 一种柔性刚性布线板，包括绝缘基板，位于绝缘基板旁边的柔性布线板，位于绝缘基板和柔性布线板之上的绝缘层，并使柔性布线板的一部分露出，并且布线层由 导体并形成在绝缘层上。 绝缘层具有锥形部分，其在由绝缘层暴露的柔性线路板的部分的方向上朝向绝缘层的端面变薄。 布线层具有形成在绝缘层的锥形部分上的倾斜部分。

公开(公告)号：US08481424B2

公开(公告)日：2013-07-09

申请号：US13243112

申请日：2011-09-23

申请人： Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

发明人： Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

IPC分类号： H05K3/00

CPC分类号： H01L23/48 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/00 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09827 ,  Y10T29/49124 ,  H01L2924/00

摘要： A method for manufacturing a multilayer printed wiring board including forming a multilayer printed wiring board structure comprising first and second buildup portions, the first buildup portion including insulating layers, conductor layers and first viaholes electrically connecting the conductor layers through the insulation layers such that the first viaholes are formed in the insulating layers, respectively, the second buildup portion including insulating layers, conductor layers and second viaholes electrically connecting the conductor layers through the insulation layers such that the first viaholes are tapered toward the second viaholes, and the second via holes are tapered toward the first viaholes. The viaholes are formed by plating openings formed after lamination of respective ones of the insulating layers of the buildup portions, and each insulating layer in the buildup portions is about 100 μm or less in thickness.

摘要翻译： 一种制造多层印刷线路板的方法，包括形成包括第一和第二积累部分的多层印刷线路板结构，所述第一累积部分包括绝缘层，导体层和通过绝缘层将导体层电连接的第一通孔，使得第一 分别在绝缘层中形成通孔，第二累积部分包括绝缘层，导体层和第二通孔，其通过绝缘层电连接导体层，使得第一通孔朝向第二通孔逐渐变细，第二通孔为 朝向第一通孔逐渐变细。 通孔由叠层后的积层部分的绝缘层各自形成的电镀开口形成，而积层部的绝缘层的厚度为100μm左右。

公开(公告)号：US08461459B2

公开(公告)日：2013-06-11

申请号：US12894777

申请日：2010-09-30

申请人： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

发明人： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

IPC分类号： H05K1/00

CPC分类号： H05K3/4691 ,  H05K2201/09127 ,  H05K2201/09536 ,  H05K2203/308 ,  Y10T29/49124

摘要： A flex-rigid wiring board includes an insulative substrate, a flexible connected body positioned beside the insulative substrate and including multiple flexible wiring boards, and an insulation layer positioned over the insulative substrate and the flexible connected body and having a portion exposing a portion of the flexible connected body. The flexible wiring boards include a double-sided flexible wiring board having a conductive layer on one surface of the double-sided flexible wiring board and a conductive layer on the opposite surface of the double-sided flexible wiring board. The flexible connected body has a conductor on one side of the flexible connected body, a conductor on the opposite side of the flexible connected body, and a through-hole conductor electrically connecting the conductors of the flexible connected body. The through-hole conductor is penetrating from one side through the opposite side of the flexible wiring boards.

摘要翻译： 柔性刚性布线板包括绝缘基板，位于绝缘基板旁边的柔性连接体，并且包括多个柔性布线板，以及位于绝缘基板和柔性连接体上方的绝缘层，并且具有暴露一部分 柔性连接体。 柔性布线板包括双面柔性布线板，该双面柔性布线板在双面柔性布线板的一个表面上具有导电层，在双面柔性布线板的相对表面上具有导电层。 柔性连接体在柔性连接体的一侧具有导体，在柔性连接体的相对侧上具有导体，以及电连接柔性连接体的导体的通孔导体。 通孔导体从一侧穿过柔性布线板的相对侧。

公开(公告)号：US08431829B2

公开(公告)日：2013-04-30

申请号：US12453632

申请日：2009-05-18

申请人： Michimasa Takahashi

发明人： Michimasa Takahashi

IPC分类号： H05K1/03 ,  H05K1/11

CPC分类号： H05K1/0298 ,  H01L24/24 ,  H01L2224/24227 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12042 ,  H05K1/141 ,  H05K1/142 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/09536 ,  H05K2201/10484 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/00

摘要： A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of the conductors of the first substrate, and the first substrate and/or the second substrate is embedded in the rigid multilayer board.

公开(公告)号：US20130081857A1

公开(公告)日：2013-04-04

申请号：US13629832

申请日：2012-09-28

申请人： MICHIMASA TAKAHASHI ,  NOBUYUKI NAGANUMA ,  TOSHINOBU ASAI ,  TERUYUKI ISHIHARA

发明人： MICHIMASA TAKAHASHI ,  NOBUYUKI NAGANUMA ,  TOSHINOBU ASAI ,  TERUYUKI ISHIHARA

IPC分类号： H05K3/36 ,  H05K1/00

CPC分类号： H05K3/0097 ,  H05K3/0052 ,  H05K2201/2072 ,  H05K2203/0169 ,  H05K2203/107 ,  H05K2203/162 ,  H05K2203/175 ,  Y10T29/49126

摘要： A method for manufacturing a multi-piece substrate includes preparing a first frame having a connecting portion to which a first piece substrate is to be connected, forming on a portion of the first piece substrate connected to a second frame a conductive pattern having a contour corresponding to the periphery of the connecting portion of the first frame, irradiating laser along the boundary between the second frame and the conductive pattern on the first piece substrate such that the first piece substrate having a joint portion which engages with the connecting portion of the first frame is detached from the second frame, and fitting the joint portion of the first piece substrate into the connecting portion of the first frame such that the first piece substrate is connected to the first frame.

摘要翻译： 一种制造多片衬底的方法包括：制备具有连接第一片衬底的连接部分的第一框架，在与第二框架连接的第一片衬底的一部分上形成具有相应轮廓的导电图案 到第一框架的连接部分的周边，沿着第一框架和第二基板上的导电图案之间的边界照射激光，使得第一基板具有与第一框架的连接部分接合的接合部分 与第二框架分离，并且将第一部件基板的接合部分装配到第一框架的连接部分中，使得第一部件基板连接到第一框架。

公开(公告)号：US08212363B2

公开(公告)日：2012-07-03

申请号：US12819805

申请日：2010-06-21

申请人： Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

发明人： Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

IPC分类号： H01L23/48

CPC分类号： H01L23/48 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/00 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09827 ,  Y10T29/49124 ,  H01L2924/00

摘要： A multilayer printed wiring board including insulating layers, conductor layers stacked alternately over the insulating layers, respectively, and viaholes formed in the insulation layers and electrically connecting the conductor layers through the insulation layers. The viaholes include a first group of viaholes and a second group of viaholes. The viaholes in the first group are tapered toward the viaholes in the second group, and the viaholes in the second group are tapered toward the viaholes in the first group. The viaholes in the first group and the the viaholes in the second group are formed in the insulating layers, respectively, and the viaholes are formed by plating openings formed after lamination of respective ones of the insulating layers, and each of the insulating layers is about 100 μm or less in thickness.

摘要翻译： 一种多层印刷布线板，分别包括绝缘层，交替地层叠在绝缘层上的导体层和形成在绝缘层中的通孔，并通过绝缘层电连接导体层。 通孔包括第一组通孔和第二组通孔。 第一组中的通孔朝向第二组中的通孔逐渐变细，第二组中的通孔在第一组中朝向通孔逐渐变细。 第一组中的通孔和第二组中的通孔分别形成在绝缘层中，并且通孔由叠层各绝缘层之后形成的电镀开口形成，并且每个绝缘层为约 厚度为100μm以下。

公开(公告)号：US20120012368A1

公开(公告)日：2012-01-19

申请号：US13242043

申请日：2011-09-23

申请人： Michimasa TAKAHASHI

发明人： Michimasa TAKAHASHI

IPC分类号： H05K1/02 ,  H05K3/36

CPC分类号： H05K3/4691 ,  H05K1/0218 ,  H05K1/142 ,  H05K3/36 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/096

摘要： A wiring board including a main substrate including a base material and having an opening portion, and a flex-rigid printed wiring board connected to the main substrate in the opening portion of the main substrate and including a rigid substrate and a flexible substrate, the rigid substrate including a non-flexible base material, the flexible substrate including a flexible base material.

摘要翻译： 一种布线基板，包括：具有基材的主基板和具有开口部分;以及柔性刚性印刷布线板，其与主基板连接在主基板的开口部分中，并且包括刚性基板和柔性基板，刚性 基材包括非柔性基材，柔性基材包括柔性基材。

公开(公告)号：US20110314668A1

公开(公告)日：2011-12-29

申请号：US13228496

申请日：2011-09-09

申请人： Sotaro ITO ,  Michimasa Takahashi ,  Yukinobu Mikado

发明人： Sotaro ITO ,  Michimasa Takahashi ,  Yukinobu Mikado

IPC分类号： H05K3/30

CPC分类号： H01L24/83 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K1/185 ,  H05K3/0035 ,  H05K3/4652 ,  H05K2201/096 ,  H05K2201/10477 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2224/13109

摘要： A method for manufacturing a multilayered printed circuit board including forming a first insulating resin substrate having a metal layer substantially corresponding to dimensions of a semiconductor device, forming a second insulating resin substrate, forming a recess extending to the metal layer of the first insulating resin substrate such that a surface of the metal layer is exposed, accommodating the semiconductor device in the recess such that the semiconductor device is mounted on the surface of the metal layer, and forming a resin insulating layer on the first insulating resin substrate such that the semiconductor device accommodated in the recess is covered.

摘要翻译： 一种多层印刷电路板的制造方法，其特征在于，包括形成具有与半导体装置的尺寸基本对应的金属层的第一绝缘性树脂基板，形成第二绝缘树脂基板，形成延伸到第一绝缘树脂基板的金属层的凹部 使得金属层的表面露出，将半导体器件容纳在凹部中，使得半导体器件安装在金属层的表面上，并且在第一绝缘树脂基板上形成树脂绝缘层，使得半导体器件 容纳在凹处被覆盖。