Invention Application
- Patent Title: Cleaning Method for Wafer
- Patent Title (中): 晶圆清洗方法
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Application No.: US12868726Application Date: 2010-08-26
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Publication No.: US20120048296A1Publication Date: 2012-03-01
- Inventor: Wen-Chin Lin , Kai-Chun Yang , Jen-Chieh Lin , Jeng-Yu Fang , Chia-Lin Hsu , Teng-Chun Tsai , Wei-Che Tsao
- Applicant: Wen-Chin Lin , Kai-Chun Yang , Jen-Chieh Lin , Jeng-Yu Fang , Chia-Lin Hsu , Teng-Chun Tsai , Wei-Che Tsao
- Main IPC: B08B7/00
- IPC: B08B7/00 ; B08B3/00
Abstract:
A cleaning method for a wafer is provided. First, a first cleaning process is performed wherein the first cleaning process includes providing a cleaning solution having a first concentration. Next, a second cleaning process is performed, wherein the second cleaning process includes providing the cleaning solution having a second concentration. The second concentration is substantially greater than the first concentration. Next, a post-cleaning process is performed to provide dilute water.
Public/Granted literature
- US1762309A Mat roaster Public/Granted day:1930-06-10
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