发明申请
- 专利标题: SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- 专利标题(中): 半导体器件及其制造方法
-
申请号: US13184318申请日: 2011-07-15
-
公开(公告)号: US20120049285A1公开(公告)日: 2012-03-01
- 发明人: Sung-Woo Hyun , Yu-Gyun Shin , Sun-Ghil Lee , Hong-Sik Yoon
- 申请人: Sung-Woo Hyun , Yu-Gyun Shin , Sun-Ghil Lee , Hong-Sik Yoon
- 优先权: KR10-2010-0082478 20100825
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L21/28
摘要:
A method of fabricating a semiconductor device and a semiconductor device are provided. The method includes method of fabricating a semiconductor device including providing a semiconductor substrate having a first semiconductor device region and a second semiconductor device region defined therein, forming a first gate structure in the first semiconductor device region, forming a second gate structure in the second semiconductor device region, forming a first trench adjacent to a first side of the first gate structure, forming a second trench adjacent to a first side of the second gate structure, and forming a first semiconductor pattern in the first trench and forming a second semiconductor pattern in the second trench, wherein the first and second trenches have different cross-sectional shapes from each other.