发明申请
- 专利标题: PROCESSING APPARATUS
- 专利标题(中): 加工设备
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申请号: US13262005申请日: 2010-03-30
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公开(公告)号: US20120055402A1公开(公告)日: 2012-03-08
- 发明人: Shuji Moriya , Toyohiko Shindo , Noboru Tamura
- 申请人: Shuji Moriya , Toyohiko Shindo , Noboru Tamura
- 申请人地址: JP Tokyo
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Tokyo
- 优先权: JP2009-088332 20090331
- 国际申请: PCT/JP2010/055703 WO 20100330
- 主分类号: C23C16/455
- IPC分类号: C23C16/455 ; C23C16/48
摘要:
A processing apparatus includes a gas supply passage for supplying a corrosive gas having a halogen, a part of the passage being made of a metal; a stabilization reaction unit which has an energy generator for supplying light energy or heat energy to the corrosive gas that has passed through the metallic part of the gas supply passage and/or has an obstacle configured to apply a collision energy to the corrosive gas that has passed through the metallic part of the gas supply passage, the collision energy being generated from a collision between the obstacle and said corrosive gas. A reaction for stabilizing a compound containing the metal and the halogen contained in the corrosive gas takes place by means of at least one of the light energy, heat energy, and collision energy; and a trapping unit which traps the compound stabilized in the stabilization reaction unit.
公开/授权文献
- US09150965B2 Processing apparatus 公开/授权日:2015-10-06
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