发明申请
US20120056181A1 METHOD OF MANUFACTURING ELECTRONIC ELEMENT AND ELECTRONIC ELEMENT
审中-公开
制造电子元件和电子元件的方法
- 专利标题： METHOD OF MANUFACTURING ELECTRONIC ELEMENT AND ELECTRONIC ELEMENT
- 专利标题（中）： 制造电子元件和电子元件的方法
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申请号： US13218907申请日： 2011-08-26
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公开(公告)号： US20120056181A1公开(公告)日： 2012-03-08
- 发明人: Masanao Kamata , Hiroaki Yamana , Iwao Yagi , Noriyuki Kawashima
- 申请人： Masanao Kamata , Hiroaki Yamana , Iwao Yagi , Noriyuki Kawashima
- 申请人地址： JP Tokyo
- 专利权人： SONY CORPORATION
- 当前专利权人： SONY CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JPP2010-197985 20100903
- 主分类号： H01L23/522
- IPC分类号： H01L23/522 ; H01L21/28 ; H05K3/00 ; H01L29/786 ; H05K1/02 ; H01L51/44 ; H01L21/768 ; H01L51/48
摘要：
There is provided a method of manufacturing an electronic element for forming the electronic element including one or more wiring layers and an organic insulating layer stacked on a substrate. The method includes a wiring layer formation step of forming the wiring layer on the substrate; an organic insulating layer formation step of forming an organic insulating layer on the wiring layer; and an irradiation step of irradiating a short-circuit portion of the wiring layer through the organic insulating layer with a laser beam having a wavelength transmissive through the organic insulating layer.
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