发明申请
- 专利标题： SEMICONDUCTOR PACKAGE
- 专利标题（中）： 半导体封装
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申请号： US13224631申请日： 2011-09-02
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公开(公告)号： US20120056313A1公开(公告)日： 2012-03-08
- 发明人: Masashi AIZAWA , Jun Morimoto , Masayuki Kato
- 申请人： Masashi AIZAWA , Jun Morimoto , Masayuki Kato
- 优先权： JP2010-198056 20100903
- 主分类号： H01L23/40
- IPC分类号： H01L23/40
摘要：
A semiconductor package includes a radiator plate including a stress alleviation section, a resin sheet arranged on the radiator plate, a pair of bus bars joined to the radiator plate through the resin sheet at positions at which the stress alleviation section is interposed between the bus bars, and a semiconductor device joined to the pair of bus bars by being sandwiched between the bus bars, and energized from outside through the pair of bus bars.