Invention Application
US20120063071A1 Machinable metal/diamond metal matrix composite compound structure and method of making same
审中-公开
可加工金属/金刚石金属基复合复合结构及其制造方法
- Patent Title: Machinable metal/diamond metal matrix composite compound structure and method of making same
- Patent Title (中): 可加工金属/金刚石金属基复合复合结构及其制造方法
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Application No.: US13135638Application Date: 2011-07-12
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Publication No.: US20120063071A1Publication Date: 2012-03-15
- Inventor: Raouf O. Loutfy , James C. Withers , Juan L. Sepulveda , Sharty Ibrahim , Kevin Loutfy
- Applicant: Raouf O. Loutfy , James C. Withers , Juan L. Sepulveda , Sharty Ibrahim , Kevin Loutfy
- Assignee: Materials and Electrochemical Research (MER) Corporation
- Current Assignee: Materials and Electrochemical Research (MER) Corporation
- Main IPC: H05K7/02
- IPC: H05K7/02 ; B32B3/24 ; B32B3/30 ; B32B15/04
Abstract:
A high thermal conductivity metal/diamond metal matrix composite made from diamond particles having thin layers of beta-SiC chemically bonded to the surfaces thereof, is utilized in combination with a machinable metal/carbonaceous material metal matrix composite in an integral metal matrix composite compound structure, to provide a machinable high thermal conductivity heat-dissipating substrate for electronic devices.
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