Invention Application
- Patent Title: HEAT RADIATING COMPONENT AND METHOD OF PRODUCING SAME
- Patent Title (中): 热辐射元件及其制造方法
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Application No.: US13228992Application Date: 2011-09-09
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Publication No.: US20120064361A1Publication Date: 2012-03-15
- Inventor: Yoriyuki SUWA , Kenji Kawamura , Syuzo Aoki , Masao Nakazawa
- Applicant: Yoriyuki SUWA , Kenji Kawamura , Syuzo Aoki , Masao Nakazawa
- Applicant Address: JP Nagano
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano
- Priority: JP2010-205631 20100914; JP2011-170156 20110803
- Main IPC: B32B3/26
- IPC: B32B3/26 ; B05D1/36 ; B32B15/00 ; B05D5/00 ; B82Y40/00 ; B82Y30/00

Abstract:
A heat radiating component includes a base including a first metal, a first plating layer formed on the base and including a second metal and carbon material structures dispersed in the second metal, and a second plating layer formed on the first plating layer. The first plating layer includes protruding parts that are parts of the carbon material structures protruding from a surface of the second metal. The second plating layer is formed on the first plating layer to cover surfaces of the protruding parts and the surface of the second metal without filling spaces between the protruding parts.
Public/Granted literature
- US09136200B2 Heat radiating component and method of producing same Public/Granted day:2015-09-15
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