公开(公告)号：US08375334B2

公开(公告)日：2013-02-12

申请号：US10435709

申请日：2003-05-09

Applicant: Masao Nakano ,  Masao Nakazawa ,  Yoshio Sasaki ,  Eiji Takeuchi ,  Yosuke Miho ,  Hajime Ishikawa ,  Takeo Kobayashi ,  Tomoki Myoi ,  Hiroshi Kasakawa ,  Akiko Watanabe ,  Shinsuke Sato

Inventor： Masao Nakano ,  Masao Nakazawa ,  Yoshio Sasaki ,  Eiji Takeuchi ,  Yosuke Miho ,  Hajime Ishikawa ,  Takeo Kobayashi ,  Tomoki Myoi ,  Hiroshi Kasakawa ,  Akiko Watanabe ,  Shinsuke Sato

IPC: G06F3/048

CPC classification number: G06F3/0481 ,  G06F1/1626 ,  G06F3/0362 ,  G06F3/0482 ,  G06F3/0485 ,  G06F3/0488 ,  G06F2200/1632

Abstract: Predetermined travel locuss are set in a three-dimensional virtual space. Menu panels displaying menu items are arranged along the travel locuss assuming a display position set as a local origin so that the normal to each LCD panel will face a virtual camera. The transparency of a menu panel is raised in accordance with its distance to the virtual camera. A scroll operation moves menu panels along the travel locuss connecting display positions P until a selected specific menu panel reaches the display position P0. A display screen is drawn with the virtual camera and menu panels are three-dimensionally displayed in rolls.By sliding a stylus pen on the LCD panel, the menu screen displayed on the LCD panel scrolls at a velocity corresponding to the drag velocity. When the stylus pen is released from the LCD panel, an application program corresponding to the menu display entity (crosshatched) is activated.

Abstract translation: 预定行驶轨迹设置在三维虚拟空间中。 显示菜单项的菜单面板沿着行进位置布置，假设显示位置被设置为本地原点，使得每个LCD面板的法线将面向虚拟相机。 根据与虚拟摄像机的距离，提高菜单面板的透明度。 滚动操作沿着连接显示位置P的行进位置移动菜单面板，直到所选择的特定菜单面板到达显示位置P0。 绘制虚拟相机的显示屏幕，菜单面板以三维显示。 通过在LCD面板上滑动触控笔，液晶显示屏上显示的菜单屏幕以对应于拖动速度的速度滚动。 当触控笔从LCD面板释放时，对应于菜单显示实体（交叉阴影线）的应用程序被激活。

公开(公告)号：US20120064361A1

公开(公告)日：2012-03-15

申请号：US13228992

申请日：2011-09-09

Applicant: Yoriyuki SUWA ,  Kenji Kawamura ,  Syuzo Aoki ,  Masao Nakazawa

Inventor： Yoriyuki SUWA ,  Kenji Kawamura ,  Syuzo Aoki ,  Masao Nakazawa

IPC: B32B3/26 ,  B05D1/36 ,  B32B15/00 ,  B05D5/00 ,  B82Y40/00 ,  B82Y30/00

CPC classification number: H01L23/373 ,  B32B15/01 ,  B82Y30/00 ,  C23C28/023 ,  H01L23/3733 ,  H01L23/3736 ,  H01L2924/0002 ,  Y10T428/12389 ,  H01L2924/00

Abstract: A heat radiating component includes a base including a first metal, a first plating layer formed on the base and including a second metal and carbon material structures dispersed in the second metal, and a second plating layer formed on the first plating layer. The first plating layer includes protruding parts that are parts of the carbon material structures protruding from a surface of the second metal. The second plating layer is formed on the first plating layer to cover surfaces of the protruding parts and the surface of the second metal without filling spaces between the protruding parts.

Abstract translation: 散热部件包括：基体，包括第一金属，形成在基底上的第一镀层，并且包括分散在第二金属中的第二金属和碳材料结构;以及形成在第一镀层上的第二镀层。 第一镀层包括作为从第二金属的表面突出的碳材料结构的部分的突出部。 第二镀层形成在第一镀层上，以覆盖突出部分的表面和第二金属的表面，而不会在突出部分之间填充空间。

公开(公告)号：US07807560B2

公开(公告)日：2010-10-05

申请号：US12173985

申请日：2008-07-16

Applicant: Kei Imafuji ,  Masao Nakazawa ,  Masaki Sanada ,  Sachiko Oda ,  Tadashi Kodaira ,  Kinji Nagata ,  Masaru Yamazaki ,  Kenjiro Enoki

Inventor： Kei Imafuji ,  Masao Nakazawa ,  Masaki Sanada ,  Sachiko Oda ,  Tadashi Kodaira ,  Kinji Nagata ,  Masaru Yamazaki ,  Kenjiro Enoki

IPC: H01L21/44

CPC classification number: H05K3/3478 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/42 ,  H01L21/4853 ,  H01L23/481 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/244 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/124

Abstract: A solder bump forming method of carrying out a reflow treatment over a conductive ball mounted on a plurality of pads, thereby forming a solder bump, includes a metal film forming step of forming a metal film capable of chemically reacting to a tackifying compound on the pads, an organic sticking layer forming step of causing a solution containing the tackifying compound to chemically react to the metal film, thereby forming an organic sticking layer on the metal film, and a conductive ball mounting step of supplying the conductive ball on the pads having the organic sticking layer formed thereon, thereby mounting the conductive ball on the pads through the metal film.

Abstract translation: 一种在安装在多个焊盘上的导电球上进行回流处理从而形成焊料凸块的焊料凸点形成方法包括形成能够与焊盘上的增粘化合物发生化学反应的金属膜的金属膜形成步骤 有机粘贴层形成步骤，使含有所述增粘化合物的溶液与所述金属膜发生化学反应，从而在所述金属膜上形成有机粘附层;以及导电性球安装步骤， 在其上形成有机粘附层，由此通过金属膜将导电球安装在焊盘上。

公开(公告)号：US20080124258A1

公开(公告)日：2008-05-29

申请号：US11739332

申请日：2007-04-24

Applicant: Norikazu Nakamura ,  Masao Nakazawa ,  Hidekazu Miyamoto ,  Kenji Miyazawa ,  Manabu Saito

Inventor： Norikazu Nakamura ,  Masao Nakazawa ,  Hidekazu Miyamoto ,  Kenji Miyazawa ,  Manabu Saito

IPC: C01G45/12 ,  B01J19/06

CPC classification number: H05K3/0055 ,  B01J19/006 ,  B01J19/18 ,  B01J19/1825 ,  B01J2219/00038 ,  B01J2219/00162 ,  B01J2219/00768 ,  C01G45/1207 ,  C01P2006/80 ,  H05K2203/0796

Abstract: In a reaction chamber (20), a used alkaline permanganate etching solution (12) is accommodated and an alkaline earth hydroxide (14) such as calcium hydroxide is added in the reaction chamber, a liquid inside of the reaction chamber is agitated, the liquid is exhausted from a side portion or a top portion of the reaction chamber through a filter (28), a precipitate (26) adhered to the filter is scraped off, and a precipitate containing a hardly soluble or insoluble matter incapable of passing through the filter and accumulated on a bottom portion of the reaction chamber is exhausted from the reaction chamber.

Abstract translation: 在反应室（20）中，容纳碱式高锰酸盐蚀刻溶液（12），在反应室中加入氢氧化钙等碱土金属氢氧化物（14），搅拌反应室内部的液体 通过过滤器（28）从反应室的侧部或顶部排出，刮去附着在过滤器上的沉淀物（26），并且含有难以溶解或不溶解的物质的沉淀物不能通过过滤器 并且积聚在反应室的底部的部分从反应室排出。

公开(公告)号：US20060062927A1

公开(公告)日：2006-03-23

申请号：US11226132

申请日：2005-09-14

Applicant: Masaki Sanada ,  Masao Nakazawa ,  Kei Imafuji

Inventor： Masaki Sanada ,  Masao Nakazawa ,  Kei Imafuji

IPC: C23C18/31

CPC classification number: C23C18/54 ,  H05K3/244

Abstract: The present invention provides a non-cyanide electroless gold plating solution free from a cyanide compound, comprising, as a completing agent of gold, a compound represented by the formula shown below or a salt thereof: X—(CH2)n—SH wherein n is 2 or 3 and X is SO3H or NH2, and having a pH value of 7 or less. The invention also provides a process for electroless gold plating using the non-cyanide electroless gold plating solution.

Abstract translation: 本发明提供一种不含氰化物的非氰化物无电镀金液，其包含作为金完成剂的由下述式表示的化合物或其盐

公开(公告)号：US5884987A

公开(公告)日：1999-03-23

申请号：US678103

申请日：1996-07-11

Applicant: Taketoshi Kawabe ,  Osamu Isobe ,  Ikurou Notsu ,  Sadahiro Takhashi ,  Masao Nakazawa

Inventor： Taketoshi Kawabe ,  Osamu Isobe ,  Ikurou Notsu ,  Sadahiro Takhashi ,  Masao Nakazawa

IPC: B60T8/1761 ,  B60T8/1763 ,  G05D17/02 ,  B60T8/30 ,  B60T8/26

CPC classification number: G05D17/02 ,  B60T8/17616 ,  B60T8/17636

Abstract: In an antilock brake device, a determining function of which the sign varies when a wheel slip ratio is identical to a target value, and a switching function comprising an integral term which is a time integral of the determining function, are set, and a brake torque target value is determined so that it is proportional to the switching function. Alternatively, the brake torque target value computed according to the determining function is corrected according to a wheel angular acceleration. In this way, a brake torque or the wheel slip ratio between a road surface and tires is precisely controlled.

Abstract translation: 在防抱死制动装置中，设定当车轮滑移比与目标值相同时符号变化的确定功能，以及包括作为确定功能的时间积分的积分项的切换功能，并且制动器 确定转矩目标值，使其与开关功能成比例。 或者，根据确定功能计算的制动转矩目标值根据车轮角加速度来校正。 以这种方式，精确地控制了路面和轮胎之间的制动扭矩或车轮滑移率。

公开(公告)号：US5643433A

公开(公告)日：1997-07-01

申请号：US172286

申请日：1993-12-23

Applicant: Katsuya Fukase ,  Takahiro Iijima ,  Masao Nakazawa ,  Shinichi Wakabayashi

Inventor： Katsuya Fukase ,  Takahiro Iijima ,  Masao Nakazawa ,  Shinichi Wakabayashi

IPC: H01L23/50 ,  H01L21/48 ,  H01L23/495 ,  H05K3/20 ,  H05K3/34 ,  C25D1/00

CPC classification number: H01L21/4821 ,  H01L23/49534 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/181 ,  H05K3/20 ,  H05K3/202 ,  H05K3/205 ,  H05K3/3421

Abstract: A method for manufacturing a lead frame employing a resist pattern formed on a matrix and having a cavity therein, in which an electro-deposition pattern is formed. A connecting cavity portion interconnects tip ends of inner lead cavity portions such that a connecting portion interconnects the tip ends of inner leads of the electro-deposition pattern formed in the cavity. The connecting piece is maintained while the electro-deposition pattern is separated from the matrix and the resist.

Abstract translation: 一种制造引线框架的方法，该引线框采用形成在基体上并在其中形成有空穴的抗蚀剂图案，其中形成电沉积图案。 连接腔部分将内部引线腔部分的末端互连，使得连接部分将形成在腔中的电沉积图案的内部引线的末端相互连接。 当电沉积图案与基体和抗蚀剂分离时，保持连接件。

公开(公告)号：US20090023281A1

公开(公告)日：2009-01-22

申请号：US12173985

申请日：2008-07-16

Applicant: Kei Imafuji ,  Masao Nakazawa ,  Masaki Sanada ,  Sachiko Oda ,  Tadashi Kodaira ,  Kinji Nagata ,  Masaru Yamazaki ,  Kenjiro Enoki

Inventor： Kei Imafuji ,  Masao Nakazawa ,  Masaki Sanada ,  Sachiko Oda ,  Tadashi Kodaira ,  Kinji Nagata ,  Masaru Yamazaki ,  Kenjiro Enoki

IPC: H01L21/768

CPC classification number: H05K3/3478 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/42 ,  H01L21/4853 ,  H01L23/481 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/244 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/124

Abstract: A solder bump forming method of carrying out a reflow treatment over a conductive ball mounted on a plurality of pads, thereby forming a solder bump, includes a metal film forming step of forming a metal film capable of chemically reacting to a tackifying compound on the pads, an organic sticking layer forming step of causing a solution containing the tackifying compound to chemically react to the metal film, thereby forming an organic sticking layer on the metal film, and a conductive ball mounting step of supplying the conductive ball on the pads having the organic sticking layer formed thereon, thereby mounting the conductive ball on the pads through the metal film.

Abstract translation: 一种在安装在多个焊盘上的导电球上进行回流处理从而形成焊料凸块的焊料凸点形成方法包括形成能够与焊盘上的增粘化合物发生化学反应的金属膜的金属膜形成步骤 有机粘贴层形成步骤，使含有所述增粘化合物的溶液与所述金属膜发生化学反应，从而在所述金属膜上形成有机粘附层;以及导电性球安装步骤， 在其上形成有机粘附层，由此通过金属膜将导电球安装在焊盘上。

公开(公告)号：US20060027462A1

公开(公告)日：2006-02-09

申请号：US11197263

申请日：2005-08-05

Applicant: Yoko Ogihara ,  Masao Nakazawa

Inventor： Yoko Ogihara ,  Masao Nakazawa

IPC: C25D3/40

CPC classification number: C25D5/34 ,  C25D3/40

Abstract: A copper strike plating bath comprising a copper cyanide compound and one or more of salts of inorganic acids and salts of organic acids. The copper cyanide compound is preferably sodium copper cyanide, potassium copper cyanide or a mixture thereof.

Abstract translation: 包含氰化铜化合物和一种或多种无机酸盐和有机酸盐的铜触镀浴。 氰化铜化合物优选为氰化铜钠，氰化钾铜或其混合物。

公开(公告)号：US20050221536A1

公开(公告)日：2005-10-06

申请号：US11096058

申请日：2005-03-31

Applicant: Masatoshi Akagawa ,  Masao Nakazawa ,  Hideto Nakazawa

Inventor： Masatoshi Akagawa ,  Masao Nakazawa ,  Hideto Nakazawa

IPC: H01L23/40 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/34 ,  H01L23/36 ,  H01L23/373

CPC classification number: H01L23/3736 ,  H01L21/4882 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16152

Abstract: A method of manufacturing a radiating plate using In as a thermal conducting bonding material 20 provided between a semiconductor device and a radiating plate 14 and serving to bond a back surface of the semiconductor device to the radiating plate, includes the steps of carrying out a cleaning treatment for cleaning a surface of the radiating plate 14, supplying the In to the radiating plate 14, heating and melting the In and hermetically adhering the In 18 to the radiating plate, thereby obtaining an In integral type radiating plate.

Abstract translation: 使用In制作作为设置在半导体器件与散热板14之间并用于将半导体器件的后表面粘合到散热板上的导热接合材料20的散热板的制造方法包括以下步骤： 用于清洁散热板14的表面的处理，将In供应到散热板14中，对In进行加热和熔化，并将In 18气密地粘附到散热板上，从而获得In积分型散热板。