Invention Application
- Patent Title: THERMALLY ZONED SUBSTRATE HOLDER ASSEMBLY
- Patent Title (中): 热隔离的基座支架组件
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Application No.: US13307176Application Date: 2011-11-30
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Publication No.: US20120067866A1Publication Date: 2012-03-22
- Inventor: Steven T. FINK , Eric J. Strang
- Applicant: Steven T. FINK , Eric J. Strang
- Applicant Address: JP Minato-ku
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Minato-ku
- Main IPC: H05B3/02
- IPC: H05B3/02 ; F25B21/02

Abstract:
A thermally zoned substrate holder including a substantially cylindrical base having top and bottom surfaces configured to support a substrate. A plurality of temperature control elements are disposed within the base. An insulator thermally separates the temperature control elements. The insulator is made from an insulting material having a lower coefficient of thermal conductivity than the base (e.g., a gas- or vacuum-filled chamber).
Public/Granted literature
- US08927907B2 Thermally zoned substrate holder assembly Public/Granted day:2015-01-06
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