发明申请
- 专利标题: THERMALLY ZONED SUBSTRATE HOLDER ASSEMBLY
- 专利标题(中): 热隔离的基座支架组件
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申请号: US13307176申请日: 2011-11-30
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公开(公告)号: US20120067866A1公开(公告)日: 2012-03-22
- 发明人: Steven T. FINK , Eric J. Strang
- 申请人: Steven T. FINK , Eric J. Strang
- 申请人地址: JP Minato-ku
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Minato-ku
- 主分类号: H05B3/02
- IPC分类号: H05B3/02 ; F25B21/02
摘要:
A thermally zoned substrate holder including a substantially cylindrical base having top and bottom surfaces configured to support a substrate. A plurality of temperature control elements are disposed within the base. An insulator thermally separates the temperature control elements. The insulator is made from an insulting material having a lower coefficient of thermal conductivity than the base (e.g., a gas- or vacuum-filled chamber).
公开/授权文献
- US08927907B2 Thermally zoned substrate holder assembly 公开/授权日:2015-01-06
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