发明申请
- 专利标题： MULTI-LAYERED SUBSTRATE
- 专利标题（中）： 多层基板
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申请号： US13307996申请日： 2011-11-30
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公开(公告)号： US20120073871A1公开(公告)日： 2012-03-29
- 发明人: Bernd Karl Appelt , Yuan-Chang Su , Ming-Chiang Lee , You-Lung Yen
- 申请人： Bernd Karl Appelt , Yuan-Chang Su , Ming-Chiang Lee , You-Lung Yen
- 申请人地址： TW Kaohsiung
- 专利权人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- 当前专利权人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- 当前专利权人地址： TW Kaohsiung
- 主分类号： H05K1/11
- IPC分类号： H05K1/11
摘要：
The present invention directs to double-sided multi-layered substrate a base, at least a through-hole passing through the base, patterned first and second metal layers formed on the two opposite surfaces of the base, and first and second plating layers. The first plating layer covers a sidewall of the through-hole and the bottom surface surrounding a bottom opening of the through hole. The second plating layer covers the first plating layer and the top surface surrounding a top opening of the through hole.
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