Invention Application
- Patent Title: MICRO-ELECTRO-MECHANICAL-SYSTEM TEMPERATURE SENSOR
- Patent Title (中): 微电子机械系统温度传感器
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Application No.: US12892406Application Date: 2010-09-28
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Publication No.: US20120076172A1Publication Date: 2012-03-29
- Inventor: Jason P. Gill , David L. Harmon , Timothy D. Sullivan
- Applicant: Jason P. Gill , David L. Harmon , Timothy D. Sullivan
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Main IPC: G01K5/52
- IPC: G01K5/52

Abstract:
The present invention provides a micro-electro-mechanical-system (MEMS) temperature sensor that employs a suspended spiral comprising a material with a positive coefficient of thermal expansion. The thermal expansion of the suspended spiral is guided to by a set of guideposts to provide a linear movement of the free end of the suspended spiral, which is converted to an electrical signal by a set of conductive rotor azimuthal fins that are interdigitated with a set of conductive stator azimuthal fins by measuring the amount of capacitive coupling therebetween. Real time temperature may thus be measured through the in-situ measurement of the capacitive coupling. Optionally, the MEMS temperature sensor may have a ratchet and a pawl to enable ex-situ measurement.
Public/Granted literature
- US08480302B2 Micro-electro-mechanical-system temperature sensor Public/Granted day:2013-07-09
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