Methods of fabricating a semiconductor stack package having a high capacity, a small volume and reliability. According to the method of fabricating a semiconductor stack package, a first semiconductor substrate including a plurality of first semiconductor chips is attached to a chip protection film. The chip protection film is expanded such that the plurality of the first semiconductor chips are spaced apart from each other. A plurality of second semiconductor chips are attached to the plurality of the first semiconductor chips, respectively. A molding layer is formed between the plurality of the first semiconductor chips and between the plurality of the second semiconductor chips. The molding layer and the chip protection film are sawed to separate the semiconductor stack package comprising the first semiconductor chip and the second semiconductor chip into a unit.