公开(公告)号：US20120077314A1

公开(公告)日：2012-03-29

申请号：US13241945

申请日：2011-09-23

Applicant: Sang-sick PARK ,  Dong-hyeon JANG ,  Chang-seong JEON ,  Teak-boon LEE

Inventor： Sang-sick PARK ,  Dong-hyeon JANG ,  Chang-seong JEON ,  Teak-boon LEE

IPC: H01L21/98

CPC classification number: H01L25/0657 ,  H01L23/3107 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2924/15311

Abstract: Methods of fabricating a semiconductor stack package having a high capacity, a small volume and reliability. According to the method of fabricating a semiconductor stack package, a first semiconductor substrate including a plurality of first semiconductor chips is attached to a chip protection film. The chip protection film is expanded such that the plurality of the first semiconductor chips are spaced apart from each other. A plurality of second semiconductor chips are attached to the plurality of the first semiconductor chips, respectively. A molding layer is formed between the plurality of the first semiconductor chips and between the plurality of the second semiconductor chips. The molding layer and the chip protection film are sawed to separate the semiconductor stack package comprising the first semiconductor chip and the second semiconductor chip into a unit.

Abstract translation: 制造具有高容量，小体积和可靠性的半导体堆叠封装的方法。 根据制造半导体堆叠封装的方法，将包括多个第一半导体芯片的第一半导体衬底附接到芯片保护膜。 芯片保护膜被扩张使得多个第一半导体芯片彼此间隔开。 多个第二半导体芯片分别附接到多个第一半导体芯片。 在多个第一半导体芯片之间和多个第二半导体芯片之间形成模制层。 将模制层和芯片保护膜锯切以将包括第一半导体芯片和第二半导体芯片的半导体堆叠封装分离成一个单元。