发明申请
US20120080686A1 Semiconductor Devices and Methods of Manufacturing Thereof 有权
半导体器件及其制造方法

Semiconductor Devices and Methods of Manufacturing Thereof
摘要:
In one embodiment, a method of forming a semiconductor device includes forming a first porous semiconductor layer over a top surface of a substrate. A first epitaxial layer is formed over the first porous semiconductor layer. A circuitry is formed within and over the first epitaxial layer. The circuitry is formed without completely oxidizing the first epitaxial layer.
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