发明申请
- 专利标题: LIGHT SENSING ELEMENT, SEMICONDUCTOR DEVICE, ELECTRONIC EQUIPMENT, MANUFACTURING METHOD OF LIGHT SENSING ELEMENT, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- 专利标题(中): 光感元件,半导体器件,电子设备,光感元件的制造方法及半导体器件的制造方法
-
申请号: US13242416申请日: 2011-09-23
-
公开(公告)号: US20120081638A1公开(公告)日: 2012-04-05
- 发明人: Hiroshi Yumoto , Shuji Yoneda , Yusuke Murakawa , Hideo Yamagata
- 申请人: Hiroshi Yumoto , Shuji Yoneda , Yusuke Murakawa , Hideo Yamagata
- 申请人地址: JP Tokyo
- 专利权人: SONY CORPORATION
- 当前专利权人: SONY CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2010-225011 20101004
- 主分类号: G02F1/1333
- IPC分类号: G02F1/1333 ; G01J1/44 ; H01L31/18 ; H01L31/102
摘要:
A light sensing element includes a photodiode formed on a semiconductor substrate surface, and a laminated structure formed on the photodiode, wherein the laminated structure includes a first layer formed of a silicon oxide film, a second layer formed on the first layer and formed of a silicon nitride film, and a third layer formed on the second layer and formed of a polysilicon film.
公开/授权文献
- US1224936A Lock-bolt. 公开/授权日:1917-05-08
信息查询
IPC分类: