发明申请
- 专利标题： Thermal Compressive Bond Head
- 专利标题（中）： 热压接头
-
申请号： US12901273申请日： 2010-10-08
-
公开(公告)号： US20120088362A1公开(公告)日： 2012-04-12
- 发明人: Chien Ling Hwang , Cheng-Chung Lin , Ying-Jui Huang , Chung-Shi Liu
- 申请人： Chien Ling Hwang , Cheng-Chung Lin , Ying-Jui Huang , Chung-Shi Liu
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L21/768
- IPC分类号： H01L21/768
摘要：
A method includes allowing a work piece having a solder bump to contact a bond head; heating the bond head until the solder bump is melted; and conducting a cooling media into the bond head to cool the solder bump and to solidify the solder bump.
公开/授权文献
- US08177862B2 Thermal compressive bond head 公开/授权日：2012-05-15
信息查询
IPC分类:
