Innovative Multi-Purpose Dipping Plate
    10.
    发明申请
    Innovative Multi-Purpose Dipping Plate 有权
    创新型多功能浸渍板

    公开(公告)号:US20140048586A1

    公开(公告)日:2014-02-20

    申请号:US13586132

    申请日:2012-08-15

    IPC分类号: B23K1/20 B23K3/08

    摘要: The present disclosure is directed to an apparatus for the application of soldering flux to a semiconductor workpiece. In some embodiments the apparatus comprises a dipping plate having a reservoir which is adapted to containing different depths of flux material. In some embodiments, the reservoir comprises at least two landing regions having sidewalls which form first and second dipping zones. The disclosed apparatus can allow dipping of the semiconductor workpiece in different depths of soldering flux without the necessity for changing dipping plates.

    摘要翻译: 本公开涉及一种用于将焊剂应用于半导体工件的装置。 在一些实施例中,该装置包括具有适于容纳不同深度的助焊剂材料的储存器的浸渍板。 在一些实施例中,储存器包括具有形成第一和第二浸渍区域的侧壁的至少两个着陆区域。 所公开的装置可以允许将半导体工件浸入不同深度的焊剂中,而不需要改变浸渍板。