发明申请
US20120091515A1 Semiconductor Devices Having Backside Illuminated Image Sensors 有权
具有背面照明图像传感器的半导体器件

Semiconductor Devices Having Backside Illuminated Image Sensors
摘要:
A semiconductor substrate includes a photodiode on a support substrate. An insulating layer is provided between the support substrate and the semiconductor substrate. A first conductive pattern is provided in the insulating layer. A first through electrode penetrates the support substrate to be in contact with the first conductive pattern.
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