发明申请
US20120094478A1 RESIST FEATURE AND REMOVABLE SPACER PITCH DOUBLING PATTERNING METHOD FOR PILLAR STRUCTURES 有权
用于支柱结构的阻力特征和可拆卸间隔器双重方式

  • 专利标题: RESIST FEATURE AND REMOVABLE SPACER PITCH DOUBLING PATTERNING METHOD FOR PILLAR STRUCTURES
  • 专利标题(中): 用于支柱结构的阻力特征和可拆卸间隔器双重方式
  • 申请号: US13331267
    申请日: 2011-12-20
  • 公开(公告)号: US20120094478A1
    公开(公告)日: 2012-04-19
  • 发明人: Yung-Tin ChenSteven J. Radigan
  • 申请人: Yung-Tin ChenSteven J. Radigan
  • 主分类号: H01L21/28
  • IPC分类号: H01L21/28 H01L21/311
RESIST FEATURE AND REMOVABLE SPACER PITCH DOUBLING PATTERNING METHOD FOR PILLAR STRUCTURES
摘要:
A method of making a semiconductor device includes forming a layer over a substrate, forming a plurality of spaced apart features of imagable material over the layer, forming sidewall spacers on the plurality of features and filling a space between a first sidewall spacer on a first feature and a second sidewall spacer on a second feature with a filler feature. The method also includes removing the sidewall spacers to leave the first feature, the filler feature and the second feature spaced apart from each other, and etching the layer using the first feature, the filler feature and the second feature as a mask.
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