Invention Application
- Patent Title: Complex Circuit Board and Fabrication Method Thereof
- Patent Title (中): 复杂电路板及其制作方法
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Application No.: US13053536Application Date: 2011-03-22
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Publication No.: US20120099342A1Publication Date: 2012-04-26
- Inventor: Ching-Feng Chen , Cheng-Min Tsai , Cheng-Yu Wang
- Applicant: Ching-Feng Chen , Cheng-Min Tsai , Cheng-Yu Wang
- Applicant Address: TW Hsin-Chu
- Assignee: AU OPTRONICS CORPORATION
- Current Assignee: AU OPTRONICS CORPORATION
- Current Assignee Address: TW Hsin-Chu
- Priority: TW099136376 20101025
- Main IPC: F21V7/22
- IPC: F21V7/22 ; H05K3/30 ; H05K3/34 ; F21V21/00

Abstract:
A complex circuit board including a printed circuit board assembly (PCBA) and a flexible printed circuit (FPC) for providing driving signals for light sources is disclosed. The PCBA includes a supporting portion and a connecting portion. The light sources are disposed above the supporting portion. The connection portion contacts electrically with a contacting portion of the FPC. The contacting portion of the FPC has a fixing hole. The connecting portion of the PCBA has a fixing portion. Moreover, the FPC has two or more than two first bend portions on the contacting portion. The fixing portion of the PCBA is inserted into the fixing hole of the FPC to complete the complex circuit board without extra attachment units. Therefore, the assembly procedure is simplified to increase throughput and the cost is reduced.
Public/Granted literature
- US08641260B2 Complex circuit board and fabrication method thereof Public/Granted day:2014-02-04
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