Invention Application
- Patent Title: LAMINATED ELECTRONIC DEVICES AND METHOD OF MANUFACTURING SAME
- Patent Title (中): 层压电子器件及其制造方法
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Application No.: US13280734Application Date: 2011-10-25
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Publication No.: US20120103675A1Publication Date: 2012-05-03
- Inventor: Kazunari KIMURA , Junichi NAKAMURA , Takeshi KIJIMA , Isao ABE , Takahiro SUZUKI , Toshiaki ARAKI
- Applicant: Kazunari KIMURA , Junichi NAKAMURA , Takeshi KIJIMA , Isao ABE , Takahiro SUZUKI , Toshiaki ARAKI
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2010-244666 20101029
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/42 ; H05K1/16

Abstract:
A laminated electronic device comprises two or more wiring layers including a first wiring layer and a second wiring layer, an insulating layer interposed between the first wiring layer and second wiring layer, and a through conductor extending through the insulating layer for electrically connecting a first conductor disposed on the first wiring layer to a second conductor disposed on the second wiring layer. The through conductor includes divergent sections at both ends, which have a diameter gradually increased toward the first conductor or second conductor.
Public/Granted literature
- US08922304B2 Laminated electronic devices with conical vias Public/Granted day:2014-12-30
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