Invention Application
- Patent Title: BONDING MATERIAL, METHOD, AND STRUCTURE
- Patent Title (中): 粘结材料，方法和结构
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Application No.: US13283490Application Date: 2011-10-27
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Publication No.: US20120107631A1Publication Date: 2012-05-03
- Inventor: Kuo-Chuang Chiu
- Applicant: Kuo-Chuang Chiu
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Priority: TWTW99137590 20101102
- Main IPC: B32B15/04
- IPC: B32B15/04 ; B32B15/20 ; C08L1/00 ; B32B37/06 ; B32B37/14 ; C08K3/22 ; B32B18/00 ; B32B37/12
Abstract:
Disclosed is a bonding structure, including a heat dissipation substrate, a eutectic layer on the heat dissipation substrate, and a copper layer on the eutectic layer. The thermal dissipation substrate includes aluminum oxide, aluminum nitride, or zirconium oxide. The eutectic layer includes aluminum oxide, aluminum nitride, or zirconium oxide doped with zinc, tin, indium, or combinations thereof.
Public/Granted literature
- US08808494B2 Bonding material, method, and structure Public/Granted day:2014-08-19
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