发明申请
- 专利标题： ELECTRODE CONNECTION STRUCTURE OF SEMICONDUCTOR CHIP, CONDUCTIVE MEMBER, AND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- 专利标题（中）： 半导体芯片，导电构件和半导体器件的电极连接结构及其制造方法
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申请号： US13096496申请日： 2011-04-28
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公开(公告)号： US20120108008A1公开(公告)日： 2012-05-03
- 发明人: Yasuhiro Yamaji , Tokihiko Yokoshima , Masahiro Aoyagi , Hiroshi Nakagawa , Katsuya Kikuchi
- 申请人： Yasuhiro Yamaji , Tokihiko Yokoshima , Masahiro Aoyagi , Hiroshi Nakagawa , Katsuya Kikuchi
- 申请人地址： JP Tokyo
- 专利权人： National Institute of Advanced Industrial Science and Technology
- 当前专利权人： National Institute of Advanced Industrial Science and Technology
- 当前专利权人地址： JP Tokyo
- 优先权： JP2006-189916 20060711; JP2007-135948 20070522
- 主分类号： H01L21/50
- IPC分类号： H01L21/50
摘要：
An electrode connection structure of a semiconductor chip is provided to realize a highly reliable electrical connection with low stress without using a bump. A conductive member may be used for such an electrode connection structure. A semiconductor device is provided wherein semiconductor chips are arranged in layers without providing the semiconductor chips with a through via, and a method is provided for manufacturing such a semiconductor device. A part or all of the surface of a horizontal recess, which is formed in an adhesive layer arranged between a first electrode of a lower layer and a second electrode of an upper layer, is provided with a conductive member for connecting the first electrode and the second electrode.
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