发明申请
- 专利标题： ARRANGEMENT COMPRISING A FIRST SEMICONDUCTOR CHIP AND A SECOND SEMICONDUCTOR CHIP CONNECTED THERETO
- 专利标题（中）： 包含第一半导体芯片和连接的第二个半导体芯片的布置
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申请号： US13355130申请日： 2012-01-20
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公开(公告)号： US20120117283A1公开(公告)日： 2012-05-10
- 发明人: Jens Barrenscheen , Peter Rohm , Angela Rohm , Hannes Estl , Axel Aue , Jens Graf , Herman Roozenbeek
- 申请人： Jens Barrenscheen , Peter Rohm , Angela Rohm , Hannes Estl , Axel Aue , Jens Graf , Herman Roozenbeek
- 申请人地址： DE Stuttgart-Feuerbach DE Neubiberg
- 专利权人： ROBERT BOSCH GMBH,INFINEON TECHNOLOGIES AG
- 当前专利权人： ROBERT BOSCH GMBH,INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Stuttgart-Feuerbach DE Neubiberg
- 优先权： EP20020026775 20021202
- 主分类号： G06F3/00
- IPC分类号： G06F3/00
摘要：
A data communication method for semiconductor chips including transmitting load control data, pilot data and a transmission clock signal from a first semiconductor chip to one or more second semiconductor chips that are each coupled to one or more electrical loads, driving the electrical loads based on a timing defined by the load control data, deriving a transmission rate by dividing the transmission clock signal by a division factor prescribed by the pilot data, and transmitting diagnostic data at the transmission rate from the one or more second semiconductor chips to the first semiconductor chip.
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