发明申请
US20120118628A1 Insert Molding Around Glass Members for Portable Electronic Devices
有权
在便携式电子设备玻璃部件周围插入成型
- 专利标题： Insert Molding Around Glass Members for Portable Electronic Devices
- 专利标题（中）： 在便携式电子设备玻璃部件周围插入成型
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申请号： US12944671申请日： 2010-11-11
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公开(公告)号： US20120118628A1公开(公告)日： 2012-05-17
- 发明人: David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Tew Tan , Lee Hua Tan
- 申请人： David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Tew Tan , Lee Hua Tan
- 主分类号： H05K5/00
- IPC分类号： H05K5/00 ; B32B37/12 ; B29C65/52 ; B32B37/24
摘要：
An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
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